Dual Transfer Units for Semiconductor Substrate Processing
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Solution Overview
Problem
Conventional substrate processing systems face challenges in achieving high throughput and reducing footprint due to limitations in transfer speed and equipment arrangement, particularly when dealing with larger substrate sizes and multi-stage processing configurations.
Innovation Solution
A substrate processing system with a planar discrete arrangement of processing chambers, utilizing dual transfer units at different heights to facilitate independent and efficient substrate transfer between loader modules and processing chambers, allowing for parallel processing and reduced equipment overlap.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a single vacuum transfer robot is used to transfer substrates between multiple processing chambers, then the system can operate continuously in vacuum without atmospheric exposure, but the transfer speed becomes a bottleneck that limits throughput
Solution Approach 1:
The single vacuum transfer function is segmented into multiple independent vacuum transfer robots (first vacuum transfer robot and second vacuum transfer robot). Each robot serves specific processing chambers, eliminating the bottleneck of a single robot while maintaining continuous vacuum operation. The segmentation allows parallel substrate transfer operations to occur simultaneously.
Solution Approach 2:
The system transitions from a two-dimensional planar arrangement to a three-dimensional configuration by vertically stacking processing chambers across multiple floors. The first vacuum transfer robot operates on the first floor while the second vacuum transfer robot operates on the second floor, utilizing the vertical dimension to enable parallel operations without increasing horizontal footprint.
2Reliability
If processing chambers are arranged in a cluster configuration with a central transfer chamber, then substrates can be transferred continuously in vacuum, but the system footprint becomes large and equipment placement becomes complex
Solution Approach 1:
Processing chambers are arranged vertically across multiple floors instead of horizontally in a cluster configuration. The first processing chambers are located on the first floor while the second processing chambers are located on the second floor, connected via vertical transfer passages. This three-dimensional arrangement dramatically reduces the horizontal footprint while maintaining continuous vacuum transfer capability.
Solution Approach 2:
The load-lock chambers and transfer chambers are merged into integrated units that serve multiple functions. The first load-lock chamber and first transfer chamber are combined, as are the second load-lock chamber and second transfer chamber, reducing the number of separate components and simplifying equipment placement.
3Adaptability or versatility
If the substrate processing system is extended to accommodate larger substrate sizes, then the processing capacity increases, but the system becomes bulkier and occupies more space
Solution Approach 1:
The system accommodates larger substrates by utilizing vertical space through multi-floor arrangement rather than expanding horizontally. The transfer passages and processing chambers are configured in the vertical dimension, allowing the system to handle larger substrates without proportionally increasing the overall system volume.
Data Source
AI summary
A substrate processing system is provided with: a first transfer unit, which extends from a loader module to a first processing chamber for processing substrates, to transfer the substrates; and a second transfer unit, which is provided below or above the first transfer unit and extends from the loader module to a second processing chamber for processing substrates, to transfer the substrates. The first processing chamber and the second processing chamber do not overlap in the vertical direction, and are disposed at positions separated from each other in a plan view. At the same time, at least a part of the first transfer unit and at least a part of the second transfer unit overlap each other in the vertical direction.