Dual Transport Mounting Section for Semiconductor Wafer Processing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing processing systems for semiconductor devices and flat panel displays face inefficiencies due to waiting times in transport sections, as they often require sequential operations at different positions within the mounting section, leading to reduced productivity and complex control requirements.
Innovation Solution
The system incorporates a first transport section and a second transport section that can enter the mounting section at different positions, allowing simultaneous operation and optimizing the spacing and positioning of holding sections to reduce waiting times and simplify control, enabling efficient passing and receiving of wafers between storage, processing, and mounting sections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of time
If the first transport section and the second transport section share the same entering position in the mounting section, then the structure is simpler, but waiting time increases and productivity decreases
Solution Approach 1:
The patent applies dimensionality change by introducing a vertical stacking dimension to the mounting section. Multiple holding sections are arranged at different vertical positions (first position, second position, third position) within the same mounting section. This allows the first transport section and second transport section to access different vertical levels simultaneously, eliminating waiting time while maintaining simple control architecture.
2Productivity
If the first transport section and the second transport section operate sequentially at the same position, then the device structure is simpler, but productivity decreases
Solution Approach 1:
The mounting section is segmented into multiple holding sections positioned at different vertical levels. Each holding section can be independently accessed by transport sections. This segmentation allows parallel operations - the first transport section can load substrates into one holding section while the second transport section processes substrates in another holding section simultaneously, thereby increasing throughput without complicating operations.
3Productivity
If multiple holding sections are provided at different positions in the stacking direction, then waiting time is reduced and productivity improves, but the device structure becomes more complex
Solution Approach 1:
The patent utilizes the vertical stacking dimension to arrange multiple holding sections at different heights within the mounting section. This vertical arrangement allows multiple substrates to be held and processed simultaneously at different levels, enabling parallel transport operations without requiring horizontal expansion or complex lateral mechanisms, thus improving productivity with minimal structural complexity.
Data Source
AI summary
According to one embodiment, a processing system includes a storage section, a processing section, a mounting section, a first transport section, and a second transport section. The mounting section includes a plurality of holding sections with a first spacing in a stacking direction. The first transport section is configured to transport the workpiece between the storage section and the mounting section and to enter the mounting section at a first position in the stacking direction. The second transport section is configured to transport the workpiece between the processing section and the mounting section and to enter the mounting section at a second position different from the first position in the stacking direction. The first position is provided at two sites in the stacking direction across the second position. The first transport section and the second transport section are enabled to enter the mounting section around a same time.