Dual Transport Substrate Handling for Exposure Processing
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Solution Overview
Problem
Substrate processing apparatuses face challenges in improving throughput due to limitations in substrate transportation speed, with existing mechanisms already operating at high speeds, necessitating alternative methods to enhance processing efficiency.
Innovation Solution
The substrate processing apparatus incorporates a dual transport mechanism system with separate paths for substrates before and after exposure processing, including cleaning and drying processing units, allowing for optimized transport paths and preventing cross-contamination, while maintaining the apparatus's footprint and efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a single transport mechanism is used for all substrates, then the device complexity is reduced, but the productivity and transport efficiency decrease due to inability to optimize paths for different processing stages
Solution Approach 1:
The transport system is segmented into multiple independent transport mechanisms (first substrate transport mechanism and second substrate transport mechanism), each dedicated to specific processing stages. This segmentation allows optimized transport paths for substrates before and after exposure processing, improving overall throughput without requiring a single complex universal transporter.
Solution Approach 2:
The interface is designed with multi-functionality to accommodate both the first and second transport mechanisms, serving as a common access point to the exposure device while supporting different transport paths. This universal interface design allows the system to handle various substrate types and processing sequences through a single standardized interface structure.
2Reliability
If substrates are transported through a shared interface without separate paths, then the device complexity is reduced, but cross-contamination occurs between substrates before and after exposure processing
Solution Approach 1:
The interface is segmented into first and second processing regions, with each region dedicated to specific substrate states (before or after exposure processing). This spatial segmentation prevents cross-contamination by physically separating substrate streams while maintaining a unified interface structure for access to the exposure device.
Solution Approach 2:
The interface acts as an intermediary structure that mediates between the processing section and the exposure device, providing separate access paths through first and second transport mechanisms. This intermediary design allows controlled interaction between different substrate streams without direct mixing, preventing contamination while maintaining system integration.
3Productivity
If the transport speed is increased beyond current levels, then the productivity improves, but the mechanical limitations and reliability issues arise
Solution Approach 1:
The transport function is segmented into multiple specialized mechanisms rather than one high-speed universal transporter. Each transport mechanism is optimized for its specific function and substrate type, allowing reliable operation at appropriate speeds without the mechanical stresses and reliability issues that would result from attempting to exceed the capabilities of a single transport system.
Data Source
AI summary
A method for processing a plurality of substrates after forming a photosensitive film on each substrate includes carrying each substrate into a placement buffer including a plurality of supporters by a first transport mechanism; taking out each substrate from the placement buffer to an interface by a second transport mechanism; carrying each substrate into the exposure device; carrying each substrate out of the exposure device into the placement buffer by the second transport mechanism; taking out each substrate from the placement buffer to the processing section by the first transport mechanism; performing development processing on each substrate; making each substrate stand by at the placement buffer based on timing at which the exposure device can accept each substrate; and making each substrate stand by at the placement buffer based on timing at which the developing device can accept each substrate.