Semiconductor Die Interconnect Layout for Dual UCIe Interface Compatibility
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Solution Overview
Problem
Advanced and standard semiconductor package interfaces, such as UCIe, are physically incompatible due to differences in bump types, patterns, signal assignments, and packaging technologies, limiting interoperability between dies with different interface types.
Innovation Solution
A semiconductor die is fabricated with both standard and advanced interfaces, allowing one interface to be activated based on the intended use, thereby enabling coupling to other dies or components using either standard or advanced interfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a semiconductor die is designed with only one interface type (standard or advanced), then the manufacturing process is simpler and more specialized, but the die cannot interoperate with dies of the other interface type
Solution Approach 1:
The semiconductor die is designed with dual interface capability, incorporating both standard UCIe interface components (first set of bumps, first interface circuit) and advanced UCIe interface components (second set of bumps, second interface circuit) on the same die. This multi-functionality allows the die to interoperate with both standard and advanced interface types, resolving the compatibility issue while maintaining a unified die structure.
Solution Approach 2:
The die is segmented into distinct interface regions: a first interface region with standard UCIe components and a second interface region with advanced UCIe components. Each region is independently configurable, allowing selective activation of standard or advanced interface functionality through the configuration data stored in the die, thereby achieving interface versatility without requiring separate dedicated dies.
2Productivity
If separate dies are manufactured for standard and advanced interfaces, then each die can be optimized for its specific interface type, but manufacturing efficiency decreases and inventory complexity increases
Solution Approach 1:
The patent merges the functionality of separate standard-interface dies and advanced-interface dies into a single unified die design. By integrating both interface types on one die with shared core circuitry and configurable interface components, the manufacturing process requires only one fabrication flow rather than maintaining separate specialized production lines, thereby improving manufacturing efficiency and reducing inventory complexity.
Solution Approach 2:
The die uses configuration data to dynamically change operational parameters, enabling the same physical die to function with either standard or advanced interface protocols. The configuration data specifies which interface type is active and how the interface components should be routed and activated, allowing a single manufactured die to adapt to different interface requirements without requiring separate fabrication processes.
3Adaptability or versatility
If both interface types are physically present on the same die, then interface compatibility is achieved, but the die area and component density increase
Solution Approach 1:
The patent utilizes vertical stacking and multi-layer interconnect structures to accommodate both standard and advanced interface components in a compact footprint. By transitioning from a purely planar layout to three-dimensional component arrangement with multiple metal layers and vias, the die can host both interface types without linearly increasing the die area, as components are distributed across different vertical levels and lateral regions.
Solution Approach 2:
Different regions of the die are optimized with locally appropriate interface components: the first interface region contains standard UCIe bumps and circuitry optimized for standard packaging, while the second interface region contains advanced UCIe micro-bumps and circuitry optimized for advanced packaging. This local differentiation allows each region to be compact while maintaining overall die versatility, avoiding the need to duplicate full interface sets across the entire die surface.
Data Source
AI summary
An example semiconductor die includes a set of circuit components, a first interconnect circuit, and a second interconnect circuit, all arranged on a substrate. The first interconnect circuit is configured for a first interface type and includes one or more first signaling components and a first connection interface. The second interconnect circuit includes second signaling component(s) and a second connection interface, and is configured for a second interface type having requirement(s) that differ from requirement(s) of the first interface type. When the first interface type is selected, the first connection interface is electrically coupled to the first signaling components, and the second connection interface is electrically isolated from the second signaling components. When the second interface type is selected, the first connection interface is electrically isolated from the first signaling components, and the second connection interface is electrically coupled to the second signaling components.