Dual-Valve Chamber Pressure Control for High-Vacuum Substrate Processing
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Solution Overview
Problem
Existing substrate processing apparatuses face issues with substrate scratching and particle adhesion due to friction, and the pressure control valves fail to support wideband pressure control in high vacuum environments, limiting film formation under stringent conditions.
Innovation Solution
A substrate processing apparatus with a process chamber, exhaust line, bypass line, and pressure control system that includes two pressure regulation valves, allowing for controlled pressure adjustments and leak checks to achieve wideband and high vacuum pressure control, reducing friction and particle generation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a single pressure regulation valve is used, then the device complexity is reduced, but the pressure control capability is limited to either wideband or high vacuum range only
Solution Approach 1:
The pressure regulation system is divided into two independent pressure regulation valves: a first pressure regulation valve for wideband pressure control and a second pressure regulation valve for high vacuum pressure control. Each valve is responsible for a specific pressure range, allowing the system to achieve both wideband and high vacuum pressure control capabilities simultaneously without excessive complexity
Solution Approach 2:
The pressure control system achieves multi-functionality by combining two pressure regulation valves that can operate independently or in coordination. The system can switch between wideband pressure control mode (using the first valve) and high vacuum pressure control mode (using the second valve), providing universal pressure control capability across different operating conditions
2Productivity
If pressure is reduced rapidly from atmospheric pressure to high vacuum, then the processing time is reduced, but substrate scratching and particle adhesion occur due to friction
Solution Approach 1:
Before rapid pressure reduction, the substrate surface is prepared by applying a protective coating or treatment to the support part that contacts the substrate. This preliminary action reduces friction and prevents particle adhesion during the subsequent rapid pressure reduction process, allowing fast processing without substrate damage
Solution Approach 2:
The pressure reduction process is made dynamic by using a first pressure regulation valve that can rapidly adjust pressure from atmospheric to high vacuum range. The system dynamically controls the pressure reduction rate, allowing rapid evacuation when safe and controlled reduction when needed to prevent substrate damage
Data Source
AI summary
There is provided a technique that includes: an exhaust line including a second pressure regulation valve; a bypass line including a first pressure regulation valve; and a pressure control controller configured to control the first pressure regulation valve and the second pressure regulation valve, and configured to: adjust an opening degree of the first pressure regulation valve to reduce a pressure in a process chamber from an atmospheric pressure to a second predetermined pressure; adjust the opening degree of the first pressure regulation valve to maintain the second predetermined pressure; adjust the opening degree of the first pressure regulation valve to reduce the pressure to a first predetermined pressure; detect the pressure; adjust an opening degree of the second pressure regulation valve to reduce the pressure to a third predetermined pressure; and adjust the opening degree of the second pressure regulation valve to maintain a processing pressure.