Dual Viscosity Cleaning Solutions for Substrate Surface Contaminant Removal
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Solution Overview
Problem
Existing substrate cleaning methods often fail to reliably remove unnecessary substances from the main surface, despite the use of cleaning solutions, due to insufficient removal efficiency.
Innovation Solution
A substrate processing apparatus that employs a dual cleaning solution system, where an alkaline or acid first cleaning solution with a lower viscosity is alternated with a second cleaning solution containing a thickener and higher viscosity, creating a shear stress-induced spiral flow to effectively remove contaminants, and a rinse liquid is used to finalize the cleaning process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional cleaning solution is used to clean the substrate surface, then the cleaning process is simple, but the removal efficiency of unnecessary substances is insufficient
Solution Approach 1:
The cleaning solution is segmented into two distinct types: a first cleaning solution with lower viscosity and a second cleaning solution with higher viscosity containing a thickener. Each cleaning solution serves a specific function in the cleaning process, with the first solution providing initial cleaning and the second solution enhancing particle removal through shear stress-induced spiral flow. This segmentation allows the system to achieve high removal efficiency while maintaining manageable complexity through clear functional differentiation.
Solution Approach 2:
The invention changes the viscosity parameter of the cleaning solution by introducing a second cleaning solution with higher viscosity containing a thickener. This parameter change enables the generation of spiral flow and shear stress that significantly enhances particle removal efficiency. The viscosity difference between the two cleaning solutions is exploited to create the necessary flow dynamics for effective contaminant removal.
2Reliability
If a single cleaning solution is used, then the process is simple and quick, but it cannot reliably remove all unnecessary substances from the substrate surface
Solution Approach 1:
The cleaning process employs periodic action by alternately supplying the first cleaning solution and the second cleaning solution onto the substrate surface in repeated cycles. Each cycle consists of supplying the first cleaning solution followed by the second cleaning solution, and this sequence is repeated multiple times. This periodic application allows the substrate surface to be progressively cleaned with each cycle, achieving reliable removal of unnecessary substances while managing the overall process time through efficient cyclic operation.
3Reliability
If a high viscosity cleaning solution is used alone, then particle removal efficiency is enhanced, but the cleaning solution may not spread uniformly on the substrate surface
Solution Approach 1:
The first cleaning solution with lower viscosity is supplied onto the substrate surface first to perform preliminary cleaning and to prepare the surface for the subsequent application of the second cleaning solution. This preliminary action ensures that the substrate surface is initially cleaned and ready to receive the high viscosity second cleaning solution, which will then provide enhanced particle removal through spiral flow without suffering from poor spreading issues.
Solution Approach 2:
The invention utilizes parameter changes by switching between two cleaning solutions with different viscosity parameters. The first cleaning solution with lower viscosity ensures good spreading and uniform distribution on the substrate surface, while the second cleaning solution with higher viscosity provides enhanced particle removal efficiency. This alternation of viscosity parameters allows the system to achieve both uniform distribution and effective particle removal.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly enhances the removal efficiency of unnecessary substances from the substrate surface, with the viscosity difference between the first and second cleaning solutions being a key factor in achieving a particle removal efficiency three times higher than traditional methods.
Implementation Method 1
the viscosity of the second cleaning solution is higher than that of the first cleaning solution, and in a state where one cleaning solution out of the first cleaning solution and the second cleaning solution is present on the main surface, the other cleaning solution is supplied onto the main surface
Implementation Method 2
it is confirmed that a spiral flow occurs inside the water droplet
Data Source
AI summary
A substrate processing apparatus includes a first cleaning solution supply part for supplying a main surface of a substrate with an alkaline or acid first cleaning solution and a second cleaning solution supply part for supplying the main surface with a second cleaning solution containing a thickener and having a viscosity higher than that of the first cleaning solution. In a state where one cleaning solution out of the first cleaning solution and the second cleaning solution is present on the main surface, the other cleaning solution is supplied onto the main surface. It is thereby possible to more reliably remove unnecessary substances on the main surface of the substrate.