Dual Wafer Handling Arm With Adjustable Frames for Multi-Size Transfer
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Solution Overview
Problem
Current robotic arms in semiconductor manufacturing are inefficient as they require time-consuming plate changes to handle wafers of different sizes and cannot simultaneously pick and place multiple sizes, reducing overall manufacturing efficiency.
Innovation Solution
A robotic arm design featuring two identically structured picking and placing units with adjustable frames and links for X-axial and Y-axial displacements, allowing simultaneous transportation of wafers of different sizes using vacuum adherence holes for secure handling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a single-plate pick-and-place mechanism is used, then the device complexity is reduced, but the productivity decreases due to time-consuming plate changes for different wafer sizes
Solution Approach 1:
The robotic arm is divided into multiple independent picking and placing units (first unit, second unit, etc.), each capable of handling different wafer sizes. This segmentation allows parallel operation on different wafer types simultaneously, eliminating the need to stop and change plates, thus resolving the contradiction between productivity and device complexity.
Solution Approach 2:
Each picking and placing unit is designed with adjustable frame spacing that can accommodate multiple wafer sizes. The same structural unit can handle both first-size wafers and second-size wafers by adjusting the frame spacing, making the system universal and eliminating the need for multiple dedicated plates, thereby improving productivity without proportionally increasing complexity.
2Adaptability or versatility
If the frame spacing is fixed, then the device complexity is reduced, but the adaptability decreases as it cannot handle multiple wafer sizes simultaneously
Solution Approach 1:
The frame spacing is made dynamically adjustable through drive portions that can change the distance between frame members based on wafer size requirements. This dynamic adjustment capability allows the same picking and placing unit to adapt to different wafer sizes (first-size and second-size), providing multi-size handling capability without requiring completely separate fixed mechanisms for each size.
Solution Approach 2:
The physical parameter of frame spacing is changed to match different wafer sizes. By adjusting the spacing parameter of the frame, the picking and placing unit can accommodate various wafer dimensions. This parameter change approach enables a single unit to handle multiple sizes, improving adaptability while keeping the overall device complexity manageable through standardized adjustable mechanisms.
3Manufacturing precision
If plate changes are required for different wafer sizes, then the manufacturing precision is maintained through dedicated plates, but the loss of time increases due to frequent plate replacements
Solution Approach 1:
The picking and placing units are pre-configured with adjustable frames that can be set to appropriate spacings for different wafer sizes before operation. This preliminary configuration eliminates the need for time-consuming plate changes during operation, as the adjustable frames can quickly adapt to different sizes while maintaining the precision needed for accurate wafer handling.
Solution Approach 2:
Multiple picking and placing units are provided as copies of the same adjustable structure. Instead of changing plates, the system uses multiple identical units that can be independently configured for different wafer sizes. This copying approach allows simultaneous handling of different sizes without the time loss associated with plate replacements, while maintaining manufacturing precision through consistent replicated designs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances wafer transportation efficiency by enabling the simultaneous handling and placement of multiple-size wafers without the need for frequent plate changes, reducing the risk of damage and increasing productivity.
Implementation Method 1
The frame is further furnished with an adherence hole for vacuuming the first-size wafer or the second-size wafer.
Data Source
AI summary
A robotic arm capable of picking and placing multi-size wafers includes a first picking and placing unit, a second picking and placing unit and a base. The first picking and placing unit is to transport a first-size or second-size wafer from a first position to a second position. The second picking and placing unit, disposed adjacent to the first picking and placing unit, is to transport the first-size or second-size wafer from the first position to the second position. The base is to construct the first picking and placing unit and the second picking and placing unit. The first picking and placing unit and the second picking and placing unit are identically structured, each of these two units has a frame with adjustable spacing, and thus these two units are able to transport the first-size and second-size wafers simultaneously.