Dual-End-Effector Wafer Transfer for Higher Cluster Tool Throughput
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Solution Overview
Problem
Conventional wafer transfer systems in semiconductor processing cluster tools are inadequate for efficiently handling substrates, leading to reduced throughput due to limitations in accessing multiple processing chambers and potential thermal non-uniformity and particle contamination issues.
Innovation Solution
The introduction of a transfer apparatus with a central hub and concentric shafts, featuring first and second end effectors with radially extending arms, allows for simultaneous engagement and transfer of substrates between multiple supports, enabling efficient repositioning and alignment within a transfer region, thereby increasing transfer speeds and accommodating multiple rows of substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional wafer transfer systems are used in cluster tools, then the system structure is simple, but the substrate throughput is reduced and transfer speed is slow
Solution Approach 1:
The transfer system is segmented into multiple independent end effectors (first end effector with first arms, second end effector with second arms) that can operate simultaneously. Each end effector can engage and transfer substrates independently, allowing parallel processing and significantly increasing substrate throughput without requiring a complete system redesign
Solution Approach 2:
Multiple end effectors and their respective arms are merged into a single integrated transfer apparatus centered on a common hub. This consolidation allows coordinated simultaneous operation of multiple arms to transfer multiple substrates in parallel, achieving high throughput while maintaining a compact footprint that doesn't excessively increase device complexity
2Speed
If conventional transfer systems are used, then the device complexity is low, but the transfer speed is slow and queue times are increased
Solution Approach 1:
The transfer system is designed to enable continuous simultaneous transfer operations through multiple arms working in parallel. While some arms are transferring substrates, other arms can be preparing for or completing transfers, eliminating idle time and maintaining continuous useful action, thereby increasing transfer speed without proportionally increasing complexity
Solution Approach 2:
The transfer apparatus employs dynamically controllable arms that can independently position, engage, and transfer substrates. The arms can be selectively activated based on real-time processing needs, allowing the system to adapt its complexity dynamically rather than requiring all components to be permanently active, thus improving speed while managing overall system complexity
3Reliability
If multiple processing chambers are accessed sequentially, then the chamber configuration is simple, but thermal non-uniformity and particle contamination occur
Solution Approach 1:
The transfer system segments the substrate transfer process into multiple simultaneous independent operations. By using multiple end effectors that can transfer substrates to different chambers at the same time, the system reduces the time each substrate spends in transit and minimizes exposure to thermal gradients and contamination risks, thereby improving processing reliability
Solution Approach 2:
The system enables preliminary positioning and engagement of multiple substrates by different arms simultaneously before transfer begins. This preliminary action allows substrates to be prepared and staged for transfer in a controlled manner, reducing the time they spend in vulnerable transition states where thermal non-uniformity and contamination could occur, thus improving reliability without excessive complexity
Data Source
AI summary
Exemplary substrate processing systems may include a transfer region housing defining an internal volume. A sidewall of the transfer region housing may define a sealable access for providing and receiving substrates. The systems may include a plurality of substrate supports disposed within the transfer region. The systems may also include a transfer apparatus having a central hub including a first shaft and a second shaft concentric with and counter-rotatable to the first shaft. The transfer apparatus may include a first end effector coupled with the first shaft. The first end effector may include a plurality of first arms. The transfer apparatus may also include a second end effector coupled with the second shaft. The second end effector may include a plurality of second arms having a number of second arms equal to the number of first arms of the first end effector.