Dual-Wavelength Laser Processing for Misaligned Composite Workpieces
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Laser processing of composite materials is hindered by misalignment and individual variations in workpieces, leading to processing defects and reduced quality and throughput, as the predetermined processing position may not be accurately irradiated with the appropriate laser beam due to variations in material composition and placement.
Innovation Solution
A laser processing device equipped with a first and second laser oscillator emitting beams of different wavelengths, a drive controller, and an analyzer that adjusts processing conditions based on signal light from the workpiece, ensuring appropriate wavelength selection for each material type, even in cases of misalignment or individual variations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a predetermined processing position is used for laser irradiation, then processing throughput is improved and spattering is reduced, but processing quality deteriorates when workpieces are misaligned or have individual variations
Solution Approach 1:
The patent implements dynamic adjustment of laser beam parameters (wavelength, intensity, pulse width) based on real-time detection of workpiece material composition and placement position. The laser processing conditions are no longer fixed but adapt dynamically to each workpiece's actual state, resolving the contradiction between fixed-position high-throughput processing and variable-quality processing of misaligned workpieces
Solution Approach 2:
The system incorporates feedback mechanisms where the detection unit identifies workpiece material and position, and this information feeds back to the control unit which adjusts laser processing parameters accordingly. This closed-loop feedback system enables the laser processing device to automatically compensate for misalignment and material variations while maintaining high throughput
2Manufacturing precision
If laser beam wavelength is switched at material change points in composite materials, then processing quality is improved, but processing complexity increases due to misalignment sensitivity
Solution Approach 1:
The detection unit automatically identifies material change points and the control unit autonomously determines optimal wavelength switching positions based on detected workpiece characteristics. The system serves itself by using its own detection capabilities to guide processing parameter adjustments, eliminating the need for external complex positioning systems or manual intervention
Solution Approach 2:
The patent changes laser beam parameters (wavelength, intensity, pulse width) based on detected material composition and workpiece position. By dynamically adjusting these parameters according to actual workpiece conditions rather than relying on fixed predetermined settings, the system simplifies control while maintaining high processing quality for composite materials
3Adaptability or versatility
If multiple laser oscillators with different wavelengths are used, then adaptability to different materials is improved, but device complexity increases
Solution Approach 1:
The laser processing device is designed with multi-functionality by incorporating multiple laser oscillators capable of emitting different wavelengths, allowing a single device to process various materials (aluminum, copper, resin, etc.) effectively. The detection unit identifies material type and the control unit selects appropriate wavelength and intensity settings, enabling one device to serve multiple material processing needs without requiring separate specialized equipment for each material
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables high-quality laser processing with high throughput by ensuring accurate wavelength selection and adjustment, regardless of misalignment or material variations, thereby improving processing precision and efficiency.
Implementation Method 1
a first laser oscillator that emits a first laser beam having a peak wavelength of a first wavelength; a second laser oscillator that emits a second laser beam having a peak wavelength of a second wavelength different than the first wavelength
Implementation Method 2
an analyzer that obtains signal light from the object and adjusts one or more processing conditions for the object based on the signal light obtained
Implementation Method 3
The drive controller drives the first laser oscillator and the second laser oscillator according to the one or more processing conditions to change an intensity of at least one of the first laser beam or the second laser beam and irradiate the object with at least one of the first laser beam or the second laser beam
Data Source
AI summary
A laser processing device includes: a first laser oscillator that emits a first laser beam having a peak wavelength of a first wavelength; a second laser oscillator that emits a second laser beam having a peak wavelength of a second wavelength different than the first wavelength; a drive controller that drives each of the first laser oscillator and the second laser oscillator; and an analyzer that obtains signal light from a workpiece and adjusts one or more processing conditions for the workpiece based on the obtained signal light. The drive controller drives the first laser oscillator and the second laser oscillator according to the one or more processing conditions to change an intensity of at least one of the first laser beam or the second laser beam and irradiate the workpiece with at least one of the first laser beam or the second laser beam.