Dual Well Read-Out Integrated Circuit for Laser Target Detection
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Solution Overview
Problem
Current infrared imaging systems require separate focal plane arrays (FPAs) and read-out integrated circuits (ROICs) to capture target and background information, leading to alignment issues, increased expense, and added weight, particularly detrimental for aerial devices like missiles.
Innovation Solution
A dual well ROIC with unique architectural features that enables the extraction of both high frequency laser return pulses and low frequency background information from a single pixel/photodetector, allowing for the integration of these signals to produce a composite image, thereby eliminating the need for two separate cameras.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If two separate FPAs and ROICs are used to capture target and background information, then both target laser return pulses and background imaging information can be captured, but the system weight increases and alignment complexity increases
Solution Approach 1:
The patent merges the functions of two separate FPAs and ROICs into a single integrated system. A first ROIC and a second ROIC are integrated onto a single substrate, with each ROIC having its own array of input cells that can be electrically connected to corresponding photodetectors in the FPA. This integration maintains the dual functionality of capturing both target laser return pulses and background imaging information while reducing system weight by eliminating the need for two separate camera assemblies.
Solution Approach 2:
The patent implements multi-functionality within a single FPA-ROIC system. The FPA contains an array of photodetectors that can detect both high-frequency laser return pulses and low-frequency background infrared radiation. The integrated ROICs process these signals differently - one path optimized for target acquisition and another for background imaging - allowing a single system to perform multiple functions that previously required separate devices.
2Adaptability or versatility
If two separate FPAs and ROICs are used to capture target and background information, then both target laser return pulses and background imaging information can be captured, but alignment complexity and expense increase
Solution Approach 1:
The patent merges the functions of two separate FPAs and ROICs into a single integrated system. A first ROIC and a second ROIC are integrated onto a single substrate, with each ROIC having its own array of input cells that can be electrically connected to corresponding photodetectors in the FPA. This integration maintains the dual functionality of capturing both target laser return pulses and background imaging information while reducing system weight by eliminating the need for two separate camera assemblies.
Solution Approach 2:
The integrated ROICs serve as intermediaries that process signals from the FPA through separate processing paths. The first ROIC processes high-frequency signals for target acquisition while the second ROIC processes low-frequency signals for background imaging. This intermediary processing architecture simplifies alignment by handling different signal types within a unified system rather than requiring precise alignment between two separate camera systems.
3Weight of moving object
If a single FPA and ROIC is used, then system weight and complexity are reduced, but the ability to separately process high frequency laser pulses and low frequency background information is lost
Solution Approach 1:
The patent segments the signal processing functions within the integrated ROICs. Each ROIC has dedicated input cells and processing circuitry optimized for specific signal types - one path for high-frequency laser return pulses and another for low-frequency background radiation. This segmentation allows the single integrated system to maintain the signal processing versatility of separate systems while benefiting from reduced weight and complexity.
Solution Approach 2:
The patent adds a dimensional aspect to signal processing by implementing parallel processing paths within the integrated ROICs. Instead of sequentially processing different signal types, the system simultaneously processes high-frequency and low-frequency signals through separate circuits on the same substrate. This dimensional expansion of processing capability allows the single system to handle multiple signal types without compromise.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables a single camera to capture high speed laser return pulses and provide imaging information on the background, enhancing signal-to-noise ratio and reducing the complexity and weight of imaging systems by integrating both active and passive signal processing paths within a single unit cell.
Implementation Method 1
a device comprising material capable of absorbing radiation over a broad spectral band such as infrared, in the process generating electrical carriers (electrons or holes) within the material
Data Source
AI summary
A single camera capable of capturing high speed laser return pulses for a target, as well as provide imaging information on the background of the target. This capability is enabled by having a read-out integrated circuit (ROIC) capable of extracting both types of information from a pixel of a focal plane array (FPA). Further, an ROIC topology that allows for the ability to distinguish between high frequency and low frequency signal paths, and provide supporting circuitry to process the two paths separately. One path may integrate the low frequency background scene to provide a high fidelity image of the scene. The second path may process high frequency noise and multiple laser pulse returns within a frame. These two paths may be combined to provide a background image with a superimposed laser return.