Dual-Workpiece Handling System for Ion Implantation Throughput
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Solution Overview
Problem
Current semiconductor processing systems face limitations in throughput due to sequential operations and time-consuming transfers of workpieces between atmospheric and vacuum environments, particularly in ion implantation processes, where short implantation times are hindered by lengthy transfer and alignment procedures.
Innovation Solution
A workpiece handling system that enables simultaneous transfer and alignment of multiple workpieces, utilizing dual-workpiece handling arms and an alignment mechanism with an elevator and characterization device, allowing for parallel processing and efficient transfer between atmospheric and vacuum environments, while maintaining serial alignment and processing capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If sequential transfer and alignment operations are used for workpieces, then alignment precision is maintained, but throughput is severely limited
Solution Approach 1:
The system divides the workpiece handling process into separate functional modules: transfer robots for moving workpieces, a dedicated aligner for orientation, and processing chambers. Multiple workpieces can be in different stages of the process simultaneously, with the aligner processing one workpiece while robots prepare or transfer others, thereby increasing throughput without sacrificing alignment precision.
Solution Approach 2:
Workpieces are pre-positioned and prepared in transport carriers before being transferred to the processing system. The aligner performs orientation adjustments in advance before workpieces enter the processing chamber, so that when processing begins, the workpiece is already properly positioned, reducing idle time during the actual processing operation.
2Reliability
If workpieces are transferred between atmospheric and vacuum environments, then processing requirements are met, but tool productivity is reduced due to sequential operations
Solution Approach 1:
Load lock chambers serve as intermediary zones between atmospheric and vacuum environments. Workpieces can be transferred to and from the vacuum processing chamber through these load locks, allowing the main processing chamber to maintain vacuum continuously while workpiece exchange occurs in the load lock region. This eliminates the need to break vacuum for each workpiece transfer, significantly improving tool productivity.
Solution Approach 2:
Different regions of the system maintain different pressure conditions simultaneously - the processing chamber remains under vacuum while load lock chambers and transport areas operate at atmospheric pressure. This localized pressure management allows continuous vacuum processing while enabling efficient workpiece handling in atmospheric regions, resolving the contradiction between processing requirements and productivity.
3Duration of action of moving object
If short duration ion implantation is performed, then processing efficiency is improved, but the benefit is negated by lengthy transfer and alignment procedures
Solution Approach 1:
The system enables continuous processing by eliminating idle time between operations. While one workpiece undergoes ion implantation, the aligner is simultaneously orienting the next workpiece, and robots are preparing subsequent workpieces for transfer. This overlapping of operations ensures that the processing chamber and ion source are continuously productive, making the short implantation duration beneficial rather than being negated by preparation time.
Data Source
AI summary
An ion implantation apparatus, system, and method are provided for transferring a plurality of workpieces between vacuum and atmospheric pressures, wherein an alignment mechanism is operable to align a plurality of workpieces for generally simultaneous transportation to a dual-workpiece load lock chamber. The alignment mechanism comprises a characterization device, an elevator, and two vertically-aligned workpiece supports for supporting two workpieces. First and second atmospheric robots are configured to generally simultaneously transfer two workpieces at a time between load lock modules, the alignment mechanism, and a FOUP. Third and fourth vacuum robots are configured to transfer one workpiece at a time between the load lock modules and a process module.