Duct Structure with Variable Rigidity for Display Cooling

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Solution Overview

Problem

Display devices and electronic devices face challenges in managing heat dissipation efficiently, leading to increased load on circuit boards and suboptimal cooling performance due to the limitations of traditional cooling fan designs.

Innovation Solution

The implementation of a duct structure with a wind shield portion that includes multiple wall portions with varying rigidity levels, guiding cooling air from the fan to heat sinks while minimizing air reflux and optimizing airflow paths to enhance heat dissipation efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a traditional cooling fan design is used, then the cooling fan can be简单地 mounted on the circuit board, but the load on the circuit board increases and cooling efficiency is suboptimal

Engineering Contradiction:
Improvecooling efficiencyVSAvoidload on circuit board
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent divides the cooling system into separate functional modules: the cooling fan is mounted on a dedicated support board rather than directly on the circuit board, and the duct structure is separated into wall portions with different rigidity levels. This segmentation reduces the load on the main circuit board while maintaining cooling effectiveness.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent introduces a support board as an intermediary component between the cooling fan and the circuit board. This support board carries the cooling fan and connects to the circuit board, thereby reducing the direct load on the circuit board while enabling proper mounting of the cooling fan.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If cooling air is not properly directed, then the structure can be simpler, but heat dissipation efficiency decreases

Engineering Contradiction:
Improveheat dissipation efficiencyVSAvoidduct structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent applies local quality by creating wall portions with different rigidity levels within the duct structure. The first wall portion has higher rigidity to maintain structural integrity and proper airflow direction, while the second wall portion has lower rigidity to reduce overall complexity and weight. This localized differentiation optimizes heat dissipation efficiency without requiring the entire duct structure to be overly complex.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively reduces the load on circuit boards and improves cooling efficiency by concentrating cooling air directly to heat-generating components, thereby enhancing overall thermal management.

Implementation Method 1

a fan that sends cooling wind to between the circuit board device and the inner surface of the housing from the ejection port

Methodology Applied
Scientific EffectForced Convection: Forced Convection

Implementation Method 2

a cooling fan that cools a cooling target component mounted on a circuit board

Methodology Applied
Scientific EffectHeat Conduction: Conduction (thermal)

Data Source

PatentUS8743541B2Display device and electronic device
Publication Date: 2014.06.03 DYNABOOK INC
  • US8743541B2 patent drawing
  • US8743541B2 patent drawing
  • US8743541B2 patent drawing

AI summary

According to one embodiment, a display device includes a housing, a circuit board device, a fan, and a wall portion. The housing includes an exhaust port. The circuit board device is housed in the housing. The fan includes an ejection port and is housed in the housing at a position separated from the exhaust port. The fan sends cooling wind to between the circuit board device and the inner surface of the housing. The wall portion is located between the inner surface of the housing and the circuit board device, and constitutes a ventilation path from the ejection port to the exhaust port. The wall portion includes a first member located in the inner surface of the housing and a second member attached to the first member and abutting on the circuit board device. The second member has a rigidity lower than the rigidity of the first member.