Dummy Bonding Part Enhances Module Impact Resistance
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Solution Overview
Problem
The challenge in miniaturizing and lightening electronic devices is compounded by the difficulty in forming external connection terminals on both surfaces of a board, which makes them prone to damage from external impacts, leading to reduced bonding reliability between the electronic device module and the main board.
Innovation Solution
The introduction of a dummy bonding part, formed from the same material as the external connection terminal, which is spaced apart and bonded to the main board through a coupling groove, increases the bonded area and enhances the coupling force, thereby improving the reliability of the electronic device module's connection to the main board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If external connection terminals are disposed on outer surfaces of the sealing part, then electrical connection between the electronic device module and main board is achieved, but the external connection terminals are prone to damage from external impacts
Solution Approach 1:
The bonding function is segmented between two distinct elements: the external connection terminal for electrical connection and the dummy bonding part for mechanical bonding. This segmentation allows each element to specialize in its function, with the dummy bonding part specifically designed to absorb external impacts and protect the external connection terminal from damage.
Solution Approach 2:
The dummy bonding part acts as an intermediary element between the sealing part and the main board. It provides a dedicated bonding interface that mediates the mechanical connection, absorbing external forces before they can reach and damage the external connection terminal.
2Volume of moving object
If electronic components are mounted on both surfaces of a board, then miniaturization of the electronic device is achieved, but sealing parts need to be formed on both surfaces making it difficult to form external connection terminals
Solution Approach 1:
The solution moves the external connection terminal from the traditional outer surface of the sealing part to the bottom surface. This dimensional repositioning allows the terminal to be formed in a location that is accessible and manufacturable, even when components are mounted on both surfaces of the board. The dummy bonding part further facilitates this by providing a bonding interface on the bottom surface.
3Reliability
If external connection terminals are disposed on outer surfaces of the sealing part, then electrical connection is established, but bonding reliability decreases when impact force is transferred to the module
Solution Approach 1:
The dummy bonding part is positioned and configured to provide beforehand cushioning against external impacts. It is designed to absorb and dissipate impact forces before they can be transmitted to the external connection terminal, thereby protecting the electrical connection from damage and maintaining bonding reliability under impact conditions.
Data Source
AI summary
The electronic device module includes a sealing part sealing an electronic component therein, and an external connection terminal disposed on one surface of the sealing part. The electronic device module also includes a dummy bonding part configured on a surface of the sealing part and spaced apart from the external connection terminal.