Dummy Bump Electrode Heat Dissipation for COF Packages
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Solution Overview
Problem
Current semiconductor packages, such as COF packages, face inefficiencies in heat dissipation due to high thermal resistance, particularly in high-temperature areas within the semiconductor chip, leading to increased costs when attempting to enlarge the package for improved heat management.
Innovation Solution
Incorporating dummy bump electrodes around high-temperature areas on the semiconductor chip and a heat relay line on the wiring substrate to create a dedicated heat dissipation route, allowing for efficient heat transfer without enlarging the package size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the semiconductor chip size is enlarged to improve heat dissipation, then heat dissipation performance is improved, but manufacturing cost increases
Solution Approach 1:
The invention divides the heat dissipation function into two parts: the original bump electrode for electrical connection and dummy bump electrodes specifically for heat dissipation. This segmentation allows heat dissipation to be enhanced without enlarging the entire chip, thus improving heat dissipation performance while controlling manufacturing costs.
Solution Approach 2:
The dummy bump electrodes act as intermediary heat transfer elements between the high-temperature area and the heat relay line. These dummy bumps facilitate heat transfer from the semiconductor chip to the wiring substrate without requiring direct electrical connection, enabling efficient heat dissipation while maintaining the original chip size.
2Temperature
If the COF package size is enlarged to increase lead line area for heat dissipation, then heat dissipation capability is improved, but manufacturing cost increases
Solution Approach 1:
The invention applies local quality by concentrating heat dissipation resources (dummy bump electrodes and heat relay line) specifically in the high-temperature area surrounding the functional element, rather than uniformly distributing heat dissipation structures across the entire package. This localized approach improves heat dissipation capability where needed most while avoiding unnecessary cost increases from enlarging the entire COF package.
3Temperature
If the lead line area is increased to enhance heat dissipation, then thermal resistance is reduced, but package size must be increased
Solution Approach 1:
The invention transitions from two-dimensional heat dissipation (expanding lead line area on the same plane) to three-dimensional heat dissipation by utilizing the vertical dimension through dummy bump electrodes that extend from the chip surface to the wiring substrate. This dimensional change enables enhanced heat dissipation capability without increasing the planar package size.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables effective heat dissipation from high-temperature areas within the semiconductor chip without increasing the package size, thereby maintaining performance while reducing costs.
Implementation Method 1
at least one heat dissipation pattern formed on said facing surface of the wiring substrate and electrically connected to said dummy bump electrode
Data Source
AI summary
A dummy bump electrode for heat-dissipating is provided on a surface of a semiconductor chip. The semiconductor chip is mounted on a wiring substrate. A lead line is formed on the wiring substrate. The heat-dissipating bump electrode and a lead line are connected to each other through a heat dissipation pattern, thereby efficiency of the heat dissipation is improved.