Semiconductor Bump Packaging with Dummy Bumps Against Detachment
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
As the size of conductive bumps in semiconductor devices decreases, the risk of detachment from the semiconductor device increases, leading to failure in maintaining the coupling state.
Innovation Solution
A method of manufacturing a packaging device involving the formation of dummy bumps that overlap with a dielectric layer, followed by a sealing pattern to isolate and secure the connecting bumps, and forming lower layer patterns to enhance mechanical coupling and reduce detachment risk.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the size of conductive bumps is reduced to increase the number and density of bumps, then the bump size decreases allowing higher integration, but the mechanical coupling strength decreases leading to detachment failure
Solution Approach 1:
The patent divides the single bump structure into two parts: a real bump for electrical connection and a dummy bump for mechanical support. The dummy bump is segmented from the real bump by positioning it adjacent to the real bump on the lower layer, allowing it to provide mechanical coupling strength without interfering with the electrical function of the real bump.
Solution Approach 2:
The dummy bump acts as an intermediary element between the real bump and the substrate. It provides mechanical support and coupling strength to the real bump through its presence on the lower layer, preventing detachment while not directly participating in electrical conduction.
2Quantity of substance
If the size of conductive bumps is reduced to increase the number and density of bumps, then the bump size decreases allowing higher integration, but the reliability decreases due to increased detachment risk
Solution Approach 1:
The patent divides the bump system into functional segments: real bumps for electrical connection and dummy bumps for mechanical reinforcement. This segmentation allows each type of bump to optimize its specific function while working together to improve overall reliability.
Solution Approach 2:
The dummy bump is created as a copy of the real bump structure but positioned differently on the lower layer. It replicates the mechanical properties of the real bump without the electrical connection function, providing structural support to enhance reliability.
3Strength
If dummy bumps are formed overlapping with the dielectric layer and sealed with a sealing pattern, then the mechanical coupling is enhanced, but the device structure becomes more complex
Solution Approach 1:
The patent merges the formation of dummy bumps with the existing dielectric layer and lower layer structure. The dummy bumps are formed on the lower layer adjacent to real bumps, and the sealing pattern is integrated into the existing packaging structure, combining multiple functions into a unified design.
Solution Approach 2:
The lower layer serves multiple functions: it supports both real bumps and dummy bumps, provides a common foundation for mechanical coupling, and enables the sealing pattern to seal both types of bumps simultaneously. This multi-functionality reduces overall structural complexity despite the addition of dummy bumps.
Data Source
AI summary
A packaging device including bumps and a method of manufacturing the packaging device are presented. In the method of manufacturing a packaging device, a dielectric layer that covers a packaging base is formed and a lower layer is formed over a packaging base including first and second connecting pads. A plurality of dummy bumps that overlaps with the dielectric layer is formed. A sealing pattern that covers the dummy bumps, filling areas between the dummy bumps, is formed. A lower layer pattern in which the plurality of dummy bumps have been disposed is formed by removing portions of the lower layer that are exposed and do not overlap with the sealing pattern.