Dummy Die Package Layout for CTE-Matched Crack and Warpage Control
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Solution Overview
Problem
Existing semiconductor device packaging methods are inadequate in preventing cracks and warpage during drop reliability testing due to coefficient of thermal expansion (CTE) mismatch between the substrate and underfill element, and lack sufficient support in stress concentration regions.
Innovation Solution
Incorporating dummy dies with a similar CTE to the substrate, placed between adjacent functional dies, to provide mechanical support and reduce the amount of underfill material needed, thereby enhancing the package's reliability and preventing cracks and warpage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If dummy dies are added to provide mechanical support and reduce stress concentrations, then reliability is improved, but device complexity increases
Solution Approach 1:
The dummy dies are non-functional elements that serve solely as mechanical support structures. They are simpler, less costly components that sacrifice functional complexity to provide the necessary structural reinforcement and stress distribution in high-stress regions of the package.
Solution Approach 2:
The dummy dies utilize coefficient of thermal expansion (CTE) matching with the substrate to prevent warpage during thermal cycling. By selecting materials with matched CTE properties, the dummy dies remain dimensionally stable through thermal transitions, maintaining package reliability without requiring complex active control mechanisms.
2Loss of substance
If the amount of underfill material is reduced using dummy dies, then manufacturing cost is reduced, but manufacturing precision requirements increase
Solution Approach 1:
The dummy dies are strategically positioned in advance during the packaging process to provide immediate mechanical support and define precise boundaries for underfill material placement. This preliminary structural framework guides the underfill dispensing process, ensuring accurate material placement with reduced volume while maintaining manufacturing precision through the dummy dies' fixed geometric positions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The dummy dies effectively support the substrate during testing, reduce stress concentrations, and minimize warpage by matching the CTE with the substrate, improving the overall reliability and reducing the underfill material requirement in semiconductor device packages.
Implementation Method 1
dummy dies with a similar CTE to the substrate, placed between adjacent functional dies, to provide mechanical support and reduce the amount of underfill material needed
Implementation Method 2
disposing an underfill element in a gap between the dummy die and each of the adjacent package components
Data Source
AI summary
A method of forming a semiconductor device package is provided. The method includes bonding a first package component and a second package component to a substrate, wherein the first and second package components are different types of electronic components that provide different functions; attaching at least one dummy die to the substrate, wherein the dummy die is electrically isolated from the substrate, wherein the first and second package components are disposed on two opposite sides of the dummy die; and disposing an underfill element between the substrate, the first package component, the second package component, and the dummy die, wherein the underfill element extends up along the sidewalls of the dummy die and laterally surrounds the sidewalls of the dummy die in a top view, wherein the underfill element has a maximum height lower than the top surface of the dummy die.