Dummy Conductive Member Structure for Delamination-Resistant Wafer Bonding
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Solution Overview
Problem
The challenge in semiconductor manufacturing is to enhance the bonding strength between wafers to prevent delamination during complex manufacturing processes, particularly in smaller package structures with increased integration density.
Innovation Solution
A semiconductor structure is designed with dummy conductive members between two wafers, which are bonded to each other through bonding layers, enhancing the bonding strength and minimizing delamination risks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If smaller package structures with smaller footprints are developed to increase integration density, then more components can be integrated into a given area, but the bonding strength between wafers decreases and delamination risk increases
Solution Approach 1:
The bonding layer is segmented into multiple functional zones: active bonding regions with bonding pads for electrical connection, and dummy bonding regions with dummy conductive members for mechanical reinforcement. This segmentation allows the structure to simultaneously achieve high integration density in active areas while maintaining bonding strength through distributed dummy structures that prevent delamination during processing.
2Productivity
If integration density is increased by developing smaller package structures, then more components can be integrated, but the complexity of manufacturing processes increases
Solution Approach 1:
The dummy conductive members are merged with the bonding layer structure, forming an integrated composite material system. The dummy members are embedded within the bonding layer during the same manufacturing process, eliminating the need for separate post-processing steps. This merging approach increases integration density while avoiding additional manufacturing complexity by combining multiple functions into a single integrated structure.
3Strength
If dummy conductive members are added to increase bonding strength, then delamination is prevented, but the device structure becomes more complex
Solution Approach 1:
The dummy conductive members serve multiple functions simultaneously: they act as mechanical reinforcement to prevent delamination, provide thermal management pathways, and serve as structural anchors during subsequent processing steps. By赋予 these dummy structures multiple functions, the patent increases bonding strength without proportionally increasing structural complexity, as the same elements fulfill multiple roles in the device architecture.
Data Source
AI summary
The present application provides a semiconductor structure having a dummy conductive member, and a manufacturing method of the semiconductor structure. The semiconductor structure includes a first wafer including a first substrate, a first dielectric layer over the first substrate, a first bonding layer over the first dielectric layer, a first via extending through the first bonding layer, and a first dummy conductive member disposed adjacent to the first via and extending partially through the first bonding layer; and a second wafer including a second bonding layer over the first bonding layer, a second via extending through the second bonding layer, a second dummy conductive member disposed adjacent to the second via and extending partially through the second bonding layer, a second dielectric layer over the second bonding layer, and a second substrate over the second dielectric layer.