Dummy Memory Cards for Thermal Management in Electronic Devices
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Solution Overview
Problem
In data storage devices, the empty spaces between DIMM cards and socket connectors hinder effective heat dissipation due to the loss of cold air and return of hot air, which is not adequately addressed by existing technologies.
Innovation Solution
The implementation of dummy memory cards and fixing devices with specific connectors and locking mechanisms that fill the empty spaces between memory cards, reducing air flow and enhancing heat dissipation by alternating the placement of memory and dummy cards.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If dummy memory cards are used to fill empty spaces, then heat dissipation is improved, but device complexity increases
Solution Approach 1:
The patent uses dummy memory cards that replicate the external form and dimensions of real memory cards to fill empty slots. These dummy cards are simple plastic replicas without electronic components, yet they effectively block air flow paths and improve heat dissipation by preventing hot air recirculation, thereby resolving the contradiction between improving thermal performance and maintaining device simplicity
Solution Approach 2:
The dummy memory cards serve as intermediary elements between the cooling system and the empty memory slots. By placing these dummy cards in empty slots, they mediate the air flow pattern within the device, blocking harmful hot air recirculation while maintaining the structural integrity and aesthetic appearance of the memory slot arrangement
2Loss of energy
If alternating placement of memory and dummy cards is used, then air flow is reduced, but manufacturing complexity increases
Solution Approach 1:
The patent segments the memory slot arrangement into alternating patterns of real memory cards and dummy memory cards. This segmentation creates a structured approach to blocking air flow paths, where each dummy card acts as an independent barrier. The alternating pattern ensures comprehensive coverage of air flow paths while maintaining a systematic manufacturing process that doesn't require complex customization
3Temperature
If dummy memory cards are implemented, then thermal management is enhanced, but cost increases
Solution Approach 1:
The dummy memory cards are designed as inexpensive plastic replicas without electronic components, making them significantly cheaper than real memory cards. Although they serve a permanent structural and thermal management function, their simple construction from basic materials keeps manufacturing costs low, effectively resolving the contradiction between enhanced thermal management and manufacturing cost
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively minimizes air flow through the empty spaces, improving heat dissipation by ensuring that cold air is retained and hot air is not easily returned, thereby enhancing the thermal management of memory modules in electronic devices.
Implementation Method 1
cold air will be lost through empty space above the DIMM socket connector, and hot air will return through the same space
Data Source
AI summary
A memory module assisting in efficient heat dissipation includes a motherboard, a plurality of fixing devices, a plurality of memory cards, and a plurality of dummy memory cards. The fixing devices are fixed on the motherboard side by side. The memory cards are fixed on some of the fixing devices as necessary, and the dummy memory cards are fixed on the remaining fixing devices which are vacant. The dummy memory cards inserted into the vacant fixing devices prevent the flow of air through the space above the vacant fixing devices. An electronic device including the memory module is also disclosed.