Dummy Conductive Mesh in Semiconductor Substrate
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Solution Overview
Problem
Existing semiconductor package structures are prone to cracking during thermal treatment or reliability testing, leading to potential electrical failures due to stress, which current technologies have not adequately addressed.
Innovation Solution
Incorporating a dummy conductive structure embedded in the substrate to resist crack propagation, along with an underfill material and interposer configuration that includes bump structures and dielectric layers to provide structural support and electrical connectivity, while minimizing additional processing complexity and cost.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If existing semiconductor package structures are used, then manufacturing is simple and cost-effective, but stress causes cracks during thermal treatment or reliability testing
Solution Approach 1:
The dummy conductive structure is embedded in the substrate before the semiconductor die is packaged, creating a preventive barrier against crack propagation before thermal treatment or reliability testing occurs. This preliminary placement of the dummy structure prevents cracks from reaching the wiring structure during subsequent stress events.
Solution Approach 2:
The dummy conductive structure acts as an intermediary element between the substrate and the wiring structure. It absorbs or blocks mechanical stress and crack propagation, protecting the functional wiring structure from damage while maintaining the overall package structure.
2Reliability
If dummy conductive structure is added to block crack propagation, then reliability improves, but manufacturing complexity and cost increase
Solution Approach 1:
The dummy conductive structure is formed using the same manufacturing processes and materials as the functional wiring structure. By merging the formation steps for dummy and functional structures, the patent avoids adding separate processing steps, thereby maintaining ease of manufacture while improving reliability.
Solution Approach 2:
The dummy conductive structure uses the same conductive material and is formed in the same inter-metal dielectric layers as the functional wiring structure. This homogeneity ensures that the dummy structure can be created without introducing new materials or processes, keeping manufacturing simple and cost-effective.
3Reliability
If dummy conductive structure is embedded in substrate, then crack propagation is blocked, but occupied space increases
Solution Approach 1:
The dummy conductive structure is placed only in specific locations where crack propagation is most likely to occur and where it would be most harmful. Rather than covering the entire substrate, the dummy structure is strategically positioned to provide maximum protection with minimum space occupation.
Solution Approach 2:
The dummy conductive structure provides more crack propagation blocking than strictly necessary, extending beyond the minimum required coverage. This excessive action ensures comprehensive protection of the wiring structure while the space occupation remains limited due to the targeted placement strategy.
Data Source
AI summary
A semiconductor package structure includes a substrate, a dummy conductive mesh structure, an interposer, an underfill material, and a semiconductor die. The substrate includes a wiring structure in dielectric layers. The dummy conductive mesh structure is embedded in the substrate and is spaced apart from the wiring structure by the dielectric layers. The interposer is disposed over the substrate. The underfill material extends between the substrate and the interposer and over the dummy conductive mesh structure. The semiconductor die is disposed over the interposer and is electrically coupled to the wiring structure through the interposer.