Dummy Pad Heat Dissipation Structure for Laser Drilling

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Solution Overview

Problem

In semiconductor packaging, the laser drilling process for exposing dummy pads can cause damage due to heat accumulation, leading to potential delamination between the pads and the dielectric layer.

Innovation Solution

The integration of heat dispersion mechanisms, such as coupling dummy pads to wide metals or redistribution structures, helps dissipate heat generated during laser drilling, reducing the risk of delamination.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If laser drilling is used to expose dummy pads, then the dummy pads can be exposed through the dielectric layer, but heat accumulation occurs causing potential delamination

Engineering Contradiction:

Improvedummy pad exposureVSAvoiddelamination risk

Core Design Contradiction:

Manufacturing precisionVSReliability

Solution Approach 1:

A heat dissipation structure is introduced as an intermediary between the dummy pad and the laser drilling process. This structure absorbs and conducts away the heat generated during laser drilling, preventing heat accumulation at the dummy pad-dielectric interface and thereby eliminating the delamination risk while maintaining the pad exposure function

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The laser drilling process inherently generates heat that could cause delamination. The invention converts this harmful heat by introducing a heat dissipation structure that actively utilizes the thermal energy, transforming it from a harmful byproduct into a controlled thermal management mechanism that protects the dummy pad assembly

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

2Reliability

If heat dissipation structures are added to prevent delamination, then reliability improves, but device complexity increases

Engineering Contradiction:

Improvedelamination preventionVSAvoidstructure complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The heat dissipation structure is designed to perform multiple functions: it serves as both a thermal management component and an electrical interconnect element within the semiconductor package. By integrating these functions into a single structure, the design adds minimal complexity while achieving both heat dissipation and electrical connectivity

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The heat dissipation function is merged with existing structural or conductive elements in the package assembly. Rather than adding a completely separate component, the solution integrates heat dissipation capabilities into already-present structures, thereby improving reliability without proportionally increasing device complexity

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach effectively reduces heat at the dummy pads, minimizing the risk of delamination and enhancing the reliability of the semiconductor package.

Implementation Method 1

the laser drilling process for exposing dummy pads can cause damage due to heat accumulation

Methodology Applied

Scientific EffectLaser heating: Laser

Implementation Method 2

coupling dummy pads to wide metals or redistribution structures, helps dissipate heat generated during laser drilling

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS12322716B2Heat dissipating features for laser drilling process

Publication Date: 2025.06.03 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

Embodiments provide metal features which dissipate heat generated from a laser drilling process for exposing dummy pads through a dielectric layer. Because the dummy pads are coupled to the metal features, the metal features act as a heat dissipation feature to pull heat from the dummy pad. As a result, reduction in heat is achieved at the dummy pad during the laser drilling process.