Dummy Pattern Insertion for Semiconductor Uniformity
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Solution Overview
Problem
Existing methods for inserting dummy patterns in semiconductor integrated circuits manufacturing, such as CMP and dry etching, are prone to variations in chip profiles and patterns, leading to reduced yield and performance due to dependence on the initial position of the first dummy pattern, which cannot ensure successful insertion across all required areas.
Innovation Solution
A method where dummy patterns are inserted starting from the boundary of an inapplicable area and arranged in a circular pattern around it, ensuring uniformity and successful placement across the chip, using Electronic Design Automation tools to determine applicable and inapplicable areas.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If dummy patterns are inserted starting from an endpoint of one boundary of the applicable area, then the insertion process is simple and straightforward, but the method cannot ensure successful insertion when the initial position is inappropriate
Solution Approach 1:
The patent inverts the traditional insertion approach by starting from the inapplicable area boundary and working inward, rather than starting from a corner endpoint and working outward. This inversion ensures that dummy patterns are preferentially placed in critical areas near device structures, guaranteeing successful insertion while maintaining operational simplicity
Solution Approach 2:
The patent applies local quality by differentiating the insertion priority based on location. Areas closer to inapplicable regions (near device structures) receive higher priority for dummy pattern insertion, while areas farther away receive lower priority. This localized approach ensures critical regions are protected while maintaining overall insertion success
2Ease of manufacture
If the initial position of the first dummy pattern is selected at one corner of the applicable area, then the insertion method is easy to implement, but dummy patterns may not be successfully inserted in all required areas
Solution Approach 1:
The patent performs preliminary action by first identifying and prioritizing regions near inapplicable areas before inserting dummy patterns. This preliminary prioritization ensures that critical areas are covered first, guaranteeing manufacturing precision while keeping the overall process easy to implement through automated algorithms
3Device complexity
If dummy patterns are inserted using traditional linear methods, then the process is simple, but within-wafer uniformity cannot be sufficiently improved to meet miniaturization demands
Solution Approach 1:
The patent transitions from traditional linear one-dimensional insertion to a two-dimensional approach by considering radial distances from inapplicable area boundaries. This dimensional change enables better within-wafer uniformity by systematically covering areas in concentric zones, while the automated algorithm maintains process simplicity
Data Source
AI summary
A method of inserting dummy patterns is provided. The method includes: determining an applicable area in which dummy patterns shall be inserted and an inapplicable area in which dummy patterns shall not be inserted on a chip; and inserting dummy patterns starting from one side of the inapplicable area and arranging the inserted dummy patterns into circles. The method of the present invention ensures that dummy patters are preferentially inserted around the device that requires protection by dummy patterns, so that good uniformity of chip pattern densities is guaranteed and within-wafer uniformity is improved, thus improving the yield and performance of semiconductor devices.