Semiconductor Package Layout Using Dummy Silicon for Heat Dissipation
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Solution Overview
Problem
Semiconductor packages face challenges in efficiently dissipating heat due to increased power consumption with high performance and capacity, leading to reduced reliability and efficiency.
Innovation Solution
A semiconductor package design that includes a stacked chip with an exposed upper surface and a dummy silicon chip in contact with the upper chip, both partially exposed from the encapsulant, enhancing heat dissipation through the upper chip and dummy silicon chip surfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If semiconductor packages are made smaller and lighter with high performance and capacity, then electronic device compactness is improved, but heat generation increases and power consumption rises
Solution Approach 1:
The patent transitions from planar heat dissipation to three-dimensional heat dissipation by exposing the upper surface of the upper chip and the side surfaces of the dummy silicon chip. This multi-directional exposure creates additional heat dissipation pathways in vertical and lateral dimensions, enabling effective thermal management in compact packages.
Solution Approach 2:
The heat dissipation function is segmented into multiple independent pathways: the upper chip's exposed upper surface provides one pathway, while the dummy silicon chip's exposed side surfaces provide additional pathways. This segmentation allows heat to be dissipated through multiple separate routes simultaneously, improving overall heat dissipation efficiency.
2Power
If high performance applications are implemented, then processing capability is improved, but heat generation becomes a major issue
Solution Approach 1:
The patent converts the harmful effect of heat generation into a beneficial outcome by designing the dummy silicon chip and exposed surfaces specifically to facilitate heat dissipation. The previously wasted space is transformed into a functional heat dissipation structure that actively manages thermal energy, turning the heat problem into a controlled thermal management solution.
3Reliability
If encapsulant covers all components, then protection is improved, but heat dissipation efficiency is reduced
Solution Approach 1:
The encapsulant provides comprehensive protection for most components, but locally exposes specific surfaces (upper chip upper surface and dummy silicon chip side surfaces) that require heat dissipation functionality. This localized differentiation allows the structure to simultaneously achieve both protection and thermal management requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Maximizes heat dissipation efficiency, improving operating performance and reliability by effectively dissipating heat generated by logic elements, reducing warpage, and maintaining signal integrity.
Implementation Method 1
A dummy silicon chip in contact with the upper chip on the lower chip
Data Source
AI summary
The present disclosure provides semiconductor packages including a heat dissipation structure. In some embodiments, the semiconductor package includes a package substrate, a stacked chip disposed on the package substrate and including a lower chip and an upper chip, a memory chip disposed on the package substrate adjacent to the stacked chip, and an encapsulant encapsulating at least a portion of the stacked chip and the memory chip on the package substrate. An upper surface of the upper chip is exposed from the encapsulant. A dummy silicon chip is in contact with the upper chip on the lower chip.