Dummy Silicon Package Structure for Interposer Warpage Control
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Solution Overview
Problem
Existing packages face challenges in providing better performance and reliability due to warpage issues that can lead to cracking of joints and unreliable connections between components.
Innovation Solution
Incorporating a dummy silicon structure laterally between integrated devices within the package, which is encapsulated by an encapsulation layer, helps to reduce warpage and improve the reliability of joints and connections by matching the material properties of the silicon structure to the die substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If integrated devices are coupled closely together on the package interposer, then the package size is reduced and integration density is improved, but warpage occurs leading to cracking of joints and unreliable connections
Solution Approach 1:
A dummy silicon structure is introduced as an intermediary element between the integrated devices and the package interposer. This dummy structure serves as a mechanical buffer that compensates for warpage forces, thereby maintaining reliable connections while allowing close spacing of functional devices. The dummy structure does not perform electrical functions but provides mechanical support to prevent joint cracking.
Solution Approach 2:
The patent modifies the mechanical parameters of the package by adding a dummy silicon structure with specific material properties and geometric characteristics. By changing the structural composition and adding this dummy element, the overall mechanical behavior of the package is altered to reduce warpage effects, enabling higher integration density without sacrificing connection reliability.
2Ease of manufacture
If the package structure is simplified without additional components, then manufacturing complexity is reduced, but warpage causes cracking and joint failure
Solution Approach 1:
The dummy silicon structure acts as a simple intermediary component that is easily integrated into the existing package manufacturing process. It provides mechanical reinforcement to prevent joint failure without requiring complex additional manufacturing steps, thus maintaining ease of manufacture while significantly improving joint strength and reliability.
Solution Approach 2:
The dummy silicon structure is made from silicon material that matches the thermal and mechanical properties of the surrounding integrated devices and interposer. This homogeneity in material properties allows the dummy structure to blend seamlessly with the existing package components, simplifying manufacturing while providing the necessary mechanical support to prevent warpage-induced joint failure.
3Reliability
If dummy silicon structure is added between integrated devices, then warpage is reduced and connection reliability is improved, but device complexity and manufacturing steps increase
Solution Approach 1:
The dummy silicon structure serves as a dedicated intermediary component whose sole function is to provide mechanical support and reduce warpage. By separating the mechanical support function from the electrical function, the package achieves improved connection reliability without complicating the electrical interconnect architecture. The dummy structure is a simple geometric element that can be easily integrated into the package layout.
Solution Approach 2:
The dummy silicon structure performs multiple functions: it provides mechanical support to reduce warpage, serves as a placeholder in the package layout, and can potentially be used for future device additions or modifications. This multi-functionality justifies the addition of the structure by providing several benefits beyond just warpage reduction, thereby offsetting the increased structural complexity.
Data Source
AI summary
A package comprising a package interposer, a first integrated device coupled to the package interposer, a second integrated device coupled to the package interposer, a dummy silicon structure located laterally between the first integrated device and the second integrated device, and a second encapsulation layer coupled to the package interposer, wherein the encapsulation layer at least partially encapsulates the first integrated device, the second integrated device and the dummy silicon structure. The package interposer comprises a first metallization portion; a second metallization portion; a first passive device located between the first metallization portion and the second metallization portion; and a first encapsulation layer located between the first metallization portion and the second metallization portion.