Dummy Support Patterns Prevent Bridging in Semiconductor Layouts
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Solution Overview
Problem
In semiconductor structures, the dishing phenomenon in low pattern density regions leads to bridging between dummy conductive structures and conductive structures in dense regions, compromising electrical performance.
Innovation Solution
A semiconductor structure design featuring dummy support patterns equidistant from dummy conductive structures, with isolation structures located between them, preventing dishing and bridging by maintaining the conductive material within designated regions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If dummy conductive structures are disposed on isolation structures in low pattern density regions to compensate insufficient pattern densities, then the pattern density is improved, but dishing phenomenon occurs to the isolation structures causing bridging between dummy conductive structures and conductive structures in dense regions
Solution Approach 1:
The patent introduces dummy support patterns as intermediary structures positioned between the dummy conductive structures and the isolation structures. These dummy support patterns act as mediators that prevent the dishing phenomenon from affecting the isolation structures, thereby preventing bridging while maintaining the pattern density compensation function. The dummy support patterns are specifically designed with dimensions and positioning that allow them to support the isolation structures without causing harmful interactions.
2Reliability
If dummy conductive structures are added to low pattern density regions, then the electrical performance is improved by compensating pattern density, but conductive material remains in low pattern density regions causing bridging
Solution Approach 1:
The patent applies preliminary anti-action by introducing dummy support patterns before the isolation structures are formed. These dummy support patterns are designed to preemptively counteract the dishing phenomenon that would otherwise occur during the formation of isolation structures in low pattern density regions. By having the dummy support patterns in place beforehand, the harmful dishing effect is prevented from occurring, thus preventing subsequent bridging of conductive material.
Data Source
AI summary
A design method of a dummy pattern layout including the following steps is provided. An integrated circuit layout design including resistor elements is obtained via a computer. The locations of dummy conductive structures are configured, wherein the dummy conductive structures are aligned with the resistor elements. The locations of dummy support patterns are configured, wherein each of the dummy support patterns is configured between two adjacent dummy conductive structures, and each of the dummy conductive structures is equidistant from the dummy support patterns on both sides.