Dummy Wafer Group Management for Continuous Film Formation
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Solution Overview
Problem
In semi-batch processing apparatuses for forming thin films on semiconductor wafers, the absence of wafers in slots leads to heat dissipation and non-uniform film formation, and existing methods for replacing dummy wafers disrupt the main processing by requiring all dummy wafers to be accommodated before replacement can occur.
Innovation Solution
A processing apparatus with a controller that classifies dummy wafers into groups, prioritizes the conveyance of non-replacement dummy wafers during processing, and performs group-to-group replacement of dummy wafers based on cumulative film thickness values, allowing for continuous operation without stopping the main processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If dummy wafers are replaced only when all dummy wafers are accommodated in the dummy stocker, then replacement can be performed, but the main processing is disrupted and productivity decreases
Solution Approach 1:
The dummy wafers are divided into multiple groups (first group and second group) within the dummy stocker. This segmentation allows the conveyance mechanism to selectively access and replace specific groups without requiring all dummy wafers to be present, enabling partial replacement operations that do not disrupt main processing.
Solution Approach 2:
The dummy wafers are pre-classified into multiple groups before replacement operations begin. This preliminary organization allows the system to perform targeted replacements on specific groups while maintaining others, enabling continuous operation without waiting for complete dummy wafer accommodation.
2Reliability
If all dummy wafers must be accommodated before replacement, then proper replacement conditions are met, but processing time is lost and efficiency decreases
Solution Approach 1:
By dividing dummy wafers into groups, the system can satisfy replacement conditions for individual groups independently. This allows replacement operations to proceed as soon as each group's conditions are met, rather than waiting for all dummy wafers to be accommodated, significantly reducing time loss.
Solution Approach 2:
The system performs partial replacement operations on specific dummy wafer groups rather than requiring complete replacement of all dummy wafers. This partial action approach maintains sufficient dummy wafers for continuous operation while reducing the time required for replacement activities.
3Productivity
If dummy wafers are not replaced timely, then main processing continues uninterrupted, but film thickness uniformity deteriorates
Solution Approach 1:
Segmenting dummy wafers into multiple groups enables staggered replacement schedules. The conveyance mechanism can systematically replace different groups at different times, ensuring that dummy wafer replacement occurs regularly without requiring complete shutdowns, thus maintaining both productivity and film uniformity.
Solution Approach 2:
The segmented group replacement approach allows the main processing to continue continuously while dummy wafer replacement occurs in between processing cycles or during non-critical periods. This maintains the useful action of film formation without interruption while still addressing the need for periodic dummy wafer replacement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the replacement of wafers within a dummy stocker without affecting the main processing, ensuring continuous film formation and maintaining uniformity by using a conveyance mechanism and controller to manage dummy wafer groups effectively.
Implementation Method 1
a conveyance mechanism configured to convey the plurality of workpieces or the plurality of dummy workpieces
Implementation Method 2
when a processing gas is supplied to the semiconductor wafers while revolving the semiconductor wafers by the rotary table, a uniform thin film is formed on the semiconductor wafers
Data Source
AI summary
Disclosed is a processing apparatus. The processing apparatus includes: a load port in which a conveyance container accommodating a plurality of semiconductor wafers is placed; a dummy wafer storage area in which a conveyance container accommodating a plurality of dummy wafers is placed; a normal-pressure conveyance room in which a first conveyance arm is installed; an equipment that processes the plurality of semiconductor wafers in a state where the semiconductor wafers and the dummy wafers which are conveyed are placed in slots, respectively; and a controller that controls each component of the processing apparatus. The controller classifies the dummy wafers accommodated in the conveyance container into a plurality of groups, and controls the first conveyance arm to preferentially convey the dummy wafers within one of the classified groups to the equipment and, in replacing the dummy wafers, to perform replacement of the dummy wafers group to group as classified.