Duplex Thermal Dye Receiver Non-voided Compliant Layer
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Solution Overview
Problem
Existing duplex thermal dye transfer receiver elements suffer from image defects due to transport rollers in thermal printers, particularly capstan roller marks, which affect the quality of prints on both sides of the substrate.
Innovation Solution
A duplex thermal dye transfer receiver element with a non-voided compliant layer having a specific heat of fusion and tensile modulus, applied on both sides of the substrate, minimizes capstan roller marks and allows for high-quality dual-sided printing with minimal defects, enabling the co-extrusion of the thermal dye image receiving layer and compliant layer for single-pass operations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a conventional compliant layer is used in duplex thermal dye transfer receiver elements, then the element can be printed on both sides, but capstan roller marks and image defects occur during transport
Solution Approach 1:
The patent applies parameter changes by precisely controlling the heat of fusion of the compliant layer polymer to be between 20-45 J/g and the tensile modulus to be between 1×10^9 to 5×10^10 dynes/cm². These specific parameter ranges optimize the material's response to thermal and mechanical stresses during transport and printing, preventing capstan roller marks while maintaining duplex printing capability
Solution Approach 2:
The patent uses composite materials by combining the compliant layer with specific polymers having defined heat of fusion and tensile modulus characteristics. This composite structure integrates the cushioning function with controlled thermal and mechanical properties, enabling the receiver element to withstand transport forces without developing image defects
2Productivity
If thermal printing is performed on both sides of the substrate, then productivity increases, but image defects from transport rollers affect both sides
Solution Approach 1:
The patent implements parameter changes by optimizing the compliant layer's heat of fusion (20-45 J/g) and tensile modulus (1×10^9 to 5×10^10 dynes/cm²) to specific ranges that enable the material to withstand the mechanical stresses of duplex printing operations. These parameter optimizations ensure consistent print quality on both sides while maintaining high productivity
3Adaptability or versatility
If metal layers or clear films are transferred onto the substrate, then product functionality enhances, but pinholes and defects appear due to roller marks
Solution Approach 1:
The patent applies parameter changes by controlling the compliant layer's heat of fusion and tensile modulus to specific ranges that minimize mechanical deformation during transport. This ensures uniform surface conditions for subsequent metal layer or clear film transfer operations, preventing pinholes and defects while enhancing product functionality
Solution Approach 2:
The patent implements beforehand cushioning by incorporating a compliant layer with optimized mechanical properties that cushions the substrate against capstan roller marks before metal layer or clear film transfer. This preventive cushioning protects the surface uniformity required for defect-free metalization and lamination
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures high-quality, defect-free thermal dye or metalized images can be printed on both sides of the substrate with reduced capstan roller marks, allowing for efficient dual-sided printing and the integration of metal layers or clear films without pinholes, enhancing print quality and process efficiency.
Implementation Method 1
a non-voided compliant layer... wherein the extruded, non-voided compliant layer has a heat of fusion of up to and including 45 joules/g of compliant layer... and a tensile modulus value of at least 7×10^7 and up to and including 5×10^10 dynes/cm^2
Implementation Method 2
A line-type thermal printing head is used to apply heat from the back of the dye-donor sheet. The thermal printing head has many heating elements and is heated up sequentially
Implementation Method 3
The compliant layer provides insulation to keep heat generated by the thermal head at the surface of the print
Data Source
AI summary
A duplex thermal dye transfer element has a substrate, a non-voided compliant layer and a thermal dye image receiving layer. These imaging elements can be imaged on either or both sides in combination with one or more thermal dye donor elements in a thermal dye transfer process. Imaging can form a dye image or transfer clear films or laminates or metalized layers to either or both sides of the substrate.