Dust Core Epoxy Composition for Defect-Free Warm Forming

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Solution Overview

Problem

Conventional epoxy resins used in dust cores are prone to molding defects such as sticking during warm forming, which compromises the strength, relative permeability, and heat resistance of the core.

Innovation Solution

Incorporating an epoxy resin with at least two or more mesogenic skeletons between epoxy bonds in the molecular chain to prevent sticking defects during warm forming, thereby enhancing the strength, relative permeability, and heat resistance of the dust core.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional epoxy resins are used in dust cores, then the manufacturing process is simple and cost-effective, but molding defects such as sticking occur during warm forming, compromising strength, relative permeability, and heat resistance

Engineering Contradiction:
Improvemolding qualityVSAvoidmolecular structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent changes the molecular structure parameters of the epoxy resin by introducing mesogenic skeletons between epoxy bonds. This structural modification alters the resin's physical and chemical properties, enabling it to prevent sticking during warm forming while maintaining curing characteristics. The specific parameter change is the incorporation of rigid mesogenic groups that modify the resin's flow and adhesion behavior at elevated temperatures.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The invention creates a composite binder system by combining epoxy resin with mesogenic skeleton structures. This composite molecular architecture integrates the beneficial properties of epoxy resins (adhesive strength, electrical insulation) with the unique characteristics of mesogenic structures (thermal stability, reduced sticking), achieving superior molding quality and core performance.

Inventive Principle:
Principle #40Composite materials

2Strength

If warm forming is performed to improve dust core density, then density and strength increase, but sticking defects occur with conventional epoxy resins

Engineering Contradiction:
Improvedust core strengthVSAvoidmolding defect rate
Core Design Contradiction:
StrengthVSManufacturing precision

Solution Approach 1:

The patent applies preliminary anti-action by pre-modifying the epoxy resin molecular structure to include mesogenic skeletons before the molding process. This pre-modification creates inherent resistance to sticking during warm forming, allowing the density-enhancing warm forming process to proceed without generating molding defects. The mesogenic structures prevent harmful adhesion between the green compact and mold surfaces in advance.

Inventive Principle:
Principle #9Preliminary anti-action

3Reliability

If epoxy resin with mesogenic skeletons is used to prevent sticking defects, then strength, relative permeability, and heat resistance improve, but the binder molecular structure becomes more complex

Engineering Contradiction:
Improveheat resistanceVSAvoidbinder molecular structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent systematically modifies the epoxy resin parameters by incorporating mesogenic skeletons with specific structural characteristics. This controlled parameter change achieves the desired improvement in heat resistance and molding quality while maintaining manageable molecular complexity through deliberate structural design rather than random complexity increase.

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS12548701B2Dust core and electronic device
Publication Date: 2026.02.10 TDK CORP
  • US12548701B2 patent drawing
  • US12548701B2 patent drawing
  • US12548701B2 patent drawing

AI summary

A dust core includes a binder and magnetic particles. The binder includes an epoxy resin. The magnetic particles are dispersed in the binder. The epoxy resin has at least two or more mesogenic skeletons between two epoxy bonds adjacent along a molecular chain.