Dust-Proof Telecommunication Chassis With Integrated Cooling Plate Filter
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Solution Overview
Problem
Telecommunication devices face challenges in harsh environments due to dust accumulation and inadequate heat dissipation, leading to performance degradation and potential failures, with existing solutions increasing the overall dimension of the system when attempting to incorporate dust filtering.
Innovation Solution
A dust-proof telecommunication system featuring a chassis with a removable filter module and a cooling plate that includes a fin structure and replaceable air filters, allowing for effective dust filtration without altering the system's dimensions, ensuring efficient heat dissipation and protection of components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a dust filter is added to protect components from dust, then dust protection is improved, but the system depth increases
Solution Approach 1:
The dust filter is nested within the existing system depth by integrating it into the cooling plate structure. The filter is positioned between the cooling plate and the fin structure, utilizing the existing spatial arrangement rather than adding external depth. This allows the filter to be housed within the same envelope as the cooling components.
Solution Approach 2:
Instead of adding filter depth in the vertical dimension, the filter is arranged in the horizontal plane within the cooling plate assembly. The filter surface extends laterally rather than adding depth, transforming the spatial arrangement from a depth-adding configuration to a planar integration that maintains the original system footprint.
2Temperature
If a cooling plate with fin structure is used to dissipate heat, then heat dissipation is improved, but dust accumulation on fins increases
Solution Approach 1:
The dust filter serves as an intermediary element positioned between the incoming air and the fin structure. It filters the air before it reaches the fins, preventing dust particles from accumulating on the heat dissipation surfaces while still allowing thermal energy to be transferred effectively through the fins.
Solution Approach 2:
Dust filtration is performed preliminarily before the air reaches the fin structure. By placing the filter upstream in the airflow path, dust particles are removed from the air stream before they can deposit on the fins, preventing dust accumulation that would otherwise impede heat dissipation.
3Object-affected harmful factors
If the system is sealed to prevent dust ingress, then dust protection is improved, but heat dissipation efficiency decreases
Solution Approach 1:
The dust filter is made of porous material that allows air to pass through while trapping dust particles. The porous structure provides sufficient airflow passage for heat dissipation while filtering out contaminants, thus maintaining both dust protection and thermal management effectiveness simultaneously.
Solution Approach 2:
The porous filter acts as an intermediary that mediates between the need for sealed protection and the need for airflow. It allows controlled passage of cooling air while blocking dust, reconciling the conflicting requirements of sealing for protection and openness for heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides effective dust filtration and heat dissipation, maintaining the system's compact dimensions while preventing airborne particle ingress and ensuring the longevity of critical components like CPUs and memory modules.
Implementation Method 1
a first air filter located at an inlet of an airflow
Implementation Method 2
a cooling plate extending between two side walls, the cooling plate and the side walls being arranged to form a protective space for computing components
Implementation Method 3
The CPU or SoC is cooled by the airflow
Data Source
AI summary
A dust-proof telecommunication system is disclosed. The dust-proof telecommunication system includes a chassis, critical components located within the chassis, and a filter module located within the chassis near at least some of the critical components that need to be cooled. For example, the critical components include a central processing unit (CPU), a system on chip (SoC), a memory module, a PCIe card, and/or a chipset. The filter module has a filter cover that surrounds at least in part the critical components, a first air filter located at an inlet of an airflow, and a second air filter located at an outlet. The critical components located at a protective space within the chassis receive and are cooled by the airflow passing through the air filter.