DUT Air Duct Shroud Adapting to Single and Double Width Form Factors
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Solution Overview
Problem
Current Independent Thermal Cooling (ITC) systems are inflexible and require separate assemblies, manufacturing tooling, and management for different device under test (DUT) form factors, leading to increased costs and time consumption when testing DUTs of varying widths.
Innovation Solution
A device under test (DUT) air duct shroud that can adapt to both double-width and single-width form factors, allowing for quick installation and effective cooling by redirecting airflow, and can be used with a DUT adapter to accommodate narrower form factors on the same device interface board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate DIB assemblies are used for different DUT widths, then each DUT form factor can be properly tested and cooled, but the system complexity increases and requires multiple assemblies and tooling
Solution Approach 1:
The housing is designed with a universal interface that can accommodate multiple DUT form factors through the use of adapters. The same housing structure serves both narrow and wide DUTs, eliminating the need for separate DIB assemblies for each form factor while maintaining proper testing and cooling capabilities.
Solution Approach 2:
Adapters are introduced as intermediary components that bridge between different DUT form factors and the standardized housing interface. These adapters enable narrow DUTs to be properly positioned and cooled within the housing designed for wider DUTs, resolving the compatibility issue without requiring multiple housing designs.
2Reliability
If separate assemblies are implemented for different DUT widths, then proper cooling channels can be provided for each form factor, but manufacturing costs and time consumption increase
Solution Approach 1:
A single housing design with standardized cooling channels serves multiple DUT form factors. The cooling system is configured to provide appropriate thermal management for both narrow and wide DUTs through the same structural platform, eliminating the need for separate manufacturing tooling and reducing production costs.
Solution Approach 2:
The cooling system is segmented into modular components where adapters can be interchangeably installed depending on the DUT form factor. This segmentation allows the main housing to remain a single standardized unit while accommodating different cooling requirements through swapable adapter components.
3Reliability
If different high-level assemblies are used for different DUT widths, then each device can be properly tested, but the testing process becomes time-consuming and less efficient
Solution Approach 1:
The standardized housing with universal interface allows the same testing assembly to handle multiple DUT form factors without requiring reconfiguration or replacement of high-level assemblies. This universality maintains testing accuracy while significantly improving throughput and efficiency.
Solution Approach 2:
Adapters are pre-configured for different DUT form factors and can be quickly swapped between tests. This preliminary preparation of adapter components eliminates the need for time-consuming assembly reconfiguration between different device types, maintaining testing rigor while accelerating the overall process.
4Device complexity
If a single housing design is used for different DUT widths, then assembly complexity is reduced, but cooling effectiveness may be compromised for narrow form factors
Solution Approach 1:
The cooling system is designed with localized cooling channels and airflow paths that can be selectively activated or directed based on the installed adapter type. This local quality adjustment ensures that narrow DUTs receive appropriate cooling focused on their specific thermal zones, maintaining effectiveness despite the universal housing design.
Solution Approach 2:
The cooling system incorporates dynamic airflow control that can adapt to different adapter configurations. This allows the same housing to provide optimized cooling performance for both narrow and wide DUTs by adjusting airflow distribution based on the installed adapter type, maintaining thermal management effectiveness across form factors.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables flexible cooling of DUTs of different widths using the same testing and cooling system, reducing the need for multiple assemblies and improving efficiency and cost-effectiveness by allowing DUTs of various widths to be tested and cooled without requiring separate setups.
Implementation Method 1
The housing is operable to receive cold air from a cooling system of the test system and direct the cold air over surfaces of a DUT housed therein for cooling
Data Source
AI summary
Embodiments of the present invention provide a DUT air duct shroud that can receive and house DUTs of a specific form factor, and can advantageously be adapted to house and cool DUTs of a different (e.g., narrower) form factor. The DUT shrouds described herein guide the DUT into the correct position and orientation to be received by the test system for quick and convenient installation, and advantageously redirect the air flow to the narrower form factor for effective cooling during testing. The DUT shrouds can be used in conjunction with device interface boards and similar components used to test memory devices and computer hardware using active cooling systems, and embodiments are also operable to house and cool consumer memory devices of different form factors.