Thermally Controllable DUT Board with Local Heater Zones
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Solution Overview
Problem
Semiconductor reliability testing faces challenges in achieving accurate electrical stress and temperature control, particularly due to spatial temperature variations and limitations in existing oven technologies that struggle with local temperature uniformity and flexibility in pin assignment configurations.
Innovation Solution
A thermally-controllable integrated unit with a heater board and locally controllable sockets, featuring both global and local heaters, along with integrated temperature sensors, ensures precise temperature control for each Device Under Test (DUT) and allows for flexible pin configurations through an accessible printed circuit board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If convection ovens are used for temperature control, then the temperature range can be maintained, but spatial temperature variations and non-uniformities are exacerbated
Solution Approach 1:
The heating system is segmented into multiple independent heating zones, each with its own heater and temperature sensor. This allows independent control of temperature in different regions, eliminating the spatial temperature variations that occur with global convection heating.
Solution Approach 2:
Each heating zone is equipped with local temperature sensors and controllable heaters that can independently adjust temperature according to local requirements. This local quality approach ensures uniform temperature distribution across different areas of the DUT board.
2Device complexity
If a single DUT board is used for testing, then the unit is compact, but the DUT board must be changed whenever pin assignment is changed
Solution Approach 1:
The DUT board is designed with universal socket configurations that can accommodate different pin assignments through reconfigurable connections. The board includes multiple socket types and repositionable components that allow the same physical board to test various DUT configurations without requiring board changes.
Solution Approach 2:
The pin assignment configuration is made dynamic through reconfigurable connections and programmable switching mechanisms on the DUT board. This allows the board to adapt its electrical connections based on the specific DUT being tested, providing versatility while maintaining a compact single-board design.
3Device complexity
If global heating is used for the entire unit, then temperature control is simplified, but local temperature variations cannot be compensated
Solution Approach 1:
The heating control system is divided into multiple independent zones, each with its own temperature sensor and heater. This segmentation allows simplified control within each zone while achieving precise local temperature management across the entire board by independently adjusting each zone.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides excellent temperature control and flexibility, addressing spatial non-uniformities and joule heating differences, while enabling efficient and precise testing across a range of semiconductor devices with customizable pin configurations.
Implementation Method 1
The concept is based on an electrically heated surface, which transfers the heat via several metal plates to a radiator
Implementation Method 2
Each socket includes an associated temperature sensor and a separately controllable local heater configured to, based on a temperature indication from the temperature sensor, heat a DUT in that socket
Implementation Method 3
Each socket includes an associated temperature sensor and a separately controllable local heater configured to, based on a temperature indication from the temperature sensor
Implementation Method 4
at least one heater board, comprised of a thermally-conductive material and provided with at least one global heater configured to globally heat the DUT board
Data Source
AI summary
In accordance with an aspect, a thermally-controllable integrated unit is configured to hold devices under test. The integrated unit includes at least one heater board, comprised of a thermally-conductive material and provided with at least one global heater configured to globally heat the DUT board. A DUT board of the integrated unit includes a DUT board in thermal contact with the at least one heater board, the DUT board including a plurality of sockets, each socket configured to hold at least one DUT. The DUT has conductor paths to conduct electrical signals between test equipment and the terminals of DUTs in the sockets. Each socket includes an associated temperature sensor and a separately controllable local heater configured to, based on a temperature indication from the temperature sensor, heat a DUT in that socket.