DUT Flow-Path Temperature Control With Direct Die Cooling
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Solution Overview
Problem
Existing techniques for controlling the temperature of a Device Under Test (DUT) face inefficiencies due to thermal resistance caused by inclusions between the fluid flowing in the flow path and the die of the DUT.
Innovation Solution
A temperature control device with a fluid supply system and purge system that directly supplies fluids through dedicated flow paths to and from the DUT, utilizing valves and pressure sensors to ensure efficient temperature control and sealing, enhancing cooling efficiency by direct contact with the die.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If liquid is supplied to a flow path of a heat exchanger provided in a contact chuck that holds the DUT, then temperature control is achieved, but cooling efficiency is poor due to thermal resistance caused by inclusions between the fluid and the die
Solution Approach 1:
The patent extracts the heat exchanger flow path from the contact chuck and replaces it with a direct fluid supply system that introduces cooling liquid directly into the DUT's internal flow path. This eliminates the intermediate heat exchanger interface and its associated thermal resistance, allowing the cooling fluid to contact the die directly through the DUT's own cooling channels.
Solution Approach 2:
The patent introduces a sealing member as an intermediary component between the fluid supply system and the DUT's flow path. This sealing member ensures proper sealing when the connection port connects to the DUT inlet, preventing fluid leakage while maintaining direct thermal contact between the cooling liquid and the die through the DUT's internal flow path.
2Loss of energy
If a fluid supply system directly supplies fluid to the DUT flow path, then cooling efficiency improves, but system complexity increases due to additional connection ports and sealing requirements
Solution Approach 1:
The contact chuck is designed with multi-functionality: it serves both as the holding mechanism for the DUT and as the fluid supply interface. The connection port on the contact chuck can selectively connect to either the DUT inlet (for cooling) or the DUT outlet (for heating), eliminating the need for separate fluid supply and return mechanisms and reducing overall system complexity.
Solution Approach 2:
The system employs dynamic valve control to switch between cooling and heating modes. By using valves to selectively open or close flow paths, the system can adaptively change its operation mode based on temperature requirements, maintaining simplicity while enabling direct fluid-to-die contact for efficient thermal management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves cooling efficiency of the DUT by directly contacting fluids with the die, reducing thermal resistance and ensuring effective temperature control.
Implementation Method 1
supplying a first fluid for temperature control to the device flow path... directly contacting fluids with the die, reducing thermal resistance
Implementation Method 2
supplying a second fluid for purge to the device flow path... ensuring effective temperature control
Data Source
AI summary
A temperature control device controls a temperature of a device under test (DUT) including a device flow path in testing the DUT, and includes: a first flow path that has a first connection port to be connected to an inlet of the device flow path; and a fluid supply system that is connected to the first flow path and supplies a first fluid for temperature control to the device flow path.