Deep Ultraviolet LED Packaging via Bonding Layer
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Solution Overview
Problem
The existing packaging process for deep ultraviolet LEDs, which involves connecting quartz glass to a substrate using a binder, faces issues with airtightness due to material incompatibility and inaccurate binder control, leading to poor luminous efficiency and reliability.
Innovation Solution
A light-emitting diode (LED) device with a substrate, an LED chip, and a light-transmissive element connected via a bonding layer outside the functional region, ensuring airtightness and luminous efficiency through precise bonding and structural design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a binder is used to connect quartz glass to substrate, then the packaging process can be completed, but the airtightness deteriorates due to material incompatibility and inaccurate binder control
Solution Approach 1:
The patent removes the binder from the packaging structure entirely, replacing it with a direct bonding interface between the substrate and transparent encapsulant. This extraction eliminates the source of airtightness problems while maintaining the packaging function through alternative bonding methods.
Solution Approach 2:
The patent achieves material compatibility by ensuring the substrate and transparent encapsulant have compatible thermal expansion coefficients and bonding characteristics, eliminating the material incompatibility issue that arose from using a binder connecting dissimilar materials.
2Reliability
If excess binder is used to ensure full gap filling, then airtightness may improve, but luminous efficiency deteriorates due to binder overflow into functional region
Solution Approach 1:
By removing the binder entirely from the system, the patent eliminates the trade-off between binder quantity for airtightness and binder overflow affecting luminous efficiency. The direct bonding interface provides airtightness without any material present in the functional region.
Solution Approach 2:
The patent introduces a bonding layer as an intermediary between the substrate and transparent encapsulant, which provides the necessary bonding and sealing function without interfering with light transmission or occupying space in the functional region.
3Illumination intensity
If quartz glass is used as light-transmissive element, then optical properties are achieved, but reliability deteriorates due to brittleness and ease of breaking
Solution Approach 1:
The patent changes the material parameters of the light-transmissive element from brittle quartz glass to materials with superior mechanical strength and fracture resistance while maintaining optical transparency, such as sapphire or engineered polymer materials.
Solution Approach 2:
The patent employs composite material structures or advanced ceramic-polymer composites for the light-transmissive element that combine optical clarity with enhanced mechanical strength and fracture toughness, overcoming the limitations of pure quartz glass.
4Loss of energy
If binder amount is reduced to prevent overflow, then luminous efficiency is maintained, but airtightness deteriorates due to insufficient gap filling
Solution Approach 1:
By eliminating the binder from the system, the patent removes the fundamental conflict between binder quantity needed for sealing and binder quantity that can be used without affecting optical performance. The bonding layer provides sealing through controlled thickness and material properties rather than volume filling.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the airtightness and reliability of deep ultraviolet LEDs by maintaining the bonding layer's integrity and preventing excess binder from affecting the functional region, thereby improving the packaging process.
Implementation Method 1
The bonding layer connects the substrate with the light-transmissive element, and is disposed on the substrate outside the functional region
Data Source
AI summary
A light-emitting diode (LED) device includes a substrate, an LED chip, a light-transmissive element, and a bonding layer. The substrate has a first surface and a second surface opposite to the first surface in a thickness direction. The first surface has a functional region. The LED chip is disposed on the functional region of the first surface of the substrate. The light-transmissive element is disposed on the first surface of the substrate, and covers the LED chip. The bonding layer connects the substrate with the light-transmissive element, and is disposed on the substrate outside the functional region. The LED device has a surrounding surface. Cross sections of the surrounding surface in the thickness direction are straight lines that extend in the thickness direction.