Divinylhexahydropentalene Triepoxide Low Viscosity High Tg
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Solution Overview
Problem
The epoxy industry faces challenges in developing materials with high glass transition temperatures, low viscosity, and enhanced UV stability, which are essential for various applications such as aerospace, semiconductor packaging, and coatings, but existing epoxy compounds often fall short in providing these properties simultaneously.
Innovation Solution
A novel epoxy compound, specifically divinylhexahydropentalene triepoxide (DVHPTO), is synthesized through a process involving ring-opening metathesis of cyclic olefins followed by epoxidation with oxidizing agents, offering low viscosity, absence of chlorine, and high glass transition temperatures when cured.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional epoxy compounds are used to achieve high glass transition temperatures, then the thermoset performance is improved, but the viscosity increases making processing difficult
Solution Approach 1:
The patent changes the chemical structure parameters of the epoxy compound by introducing specific cyclic aliphatic groups and controlling the ratio of aromatic to aliphatic hydrocarbon components. This structural modification allows achieving high glass transition temperature (above 150°C) while maintaining lower viscosity compared to conventional epoxies, resolving the contradiction between thermal performance and processability
2Reliability
If existing epoxy compounds provide enhanced UV stability, then the coating durability is improved, but the material properties such as glass transition temperature and viscosity are compromised
Solution Approach 1:
The patent creates a composite epoxy system combining specific aromatic and aliphatic hydrocarbon groups in defined ratios. The aromatic components provide UV stability and durability, while the aliphatic cyclic components contribute to high glass transition temperature. This composite structure achieves both UV resistance and high thermal performance simultaneously
3Ease of operation
If epoxy compounds with low viscosity are used for semiconductor packaging, then the processing ease is improved, but the glass transition temperature decreases affecting performance
Solution Approach 1:
The patent applies local quality by incorporating specific cyclic aliphatic structures (such as norbornane, bicyclo[2.2.1]heptane) at targeted positions within the epoxy molecule. These localized structural features provide rigidity and high glass transition temperature, while the overall molecular design maintains appropriate fluidity for processing, achieving both low viscosity and high thermal performance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The novel epoxy compound provides a balance of low viscosity in the uncured state and high glass transition temperatures in the cured form, enabling improved formulation strategies and expanded hardener options, while maintaining low volatility and UV stability, thus addressing the industry's material demands.
Implementation Method 1
ring-opening metathesis of a cyclic olefin
Implementation Method 2
epoxidizing the product of step (a) with at least one oxidizing agent
Data Source
AI summary
A novel low viscosity epoxide having the following general Structure (I): Structure (I) wherein R1 and R2 can be, but is not limited to, hydrogen or a hydrocarbon group having from C1 to about C20 carbon atoms; with the proviso that R1 and R2 are not both hydrogen.