Dye-Modified Polymer Side Chain for Curable Resin Heat Resistance
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Solution Overview
Problem
Current curable resin compositions lack excellent heat resistance, solubility, coating uniformity, and chemical resistance, which are essential for high-performance applications such as LCD color filters and organic light-emitting diodes, and they often suffer from low sensitivity and developability, leading to productivity issues and display defects.
Innovation Solution
A polymer compound with specific repeating units, including a dye integrated into the side chain of a polymer binder, is developed, enhancing heat resistance, solubility, and chemical resistance, and used in a curable resin composition that also includes an alkali soluble polymer resin, a polymerizable compound, and a photoinitiator.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a dye is used in curable resin composition, then color uniformity and coating quality are improved, but heat resistance and chemical resistance deteriorate
Solution Approach 1:
The patent uses a composite resin system combining acrylic resin and vinyl resin in specific ratios (acrylic resin 30-70 wt%, vinyl resin 70-30 wt%). This composite structure provides both the coating uniformity of dye-containing formulations and the heat/chemical resistance of the crosslinked polymer network, resolving the contradiction between color quality and thermal stability.
Solution Approach 2:
The patent optimizes multiple parameters including resin composition ratios, molecular weight ranges (10,000-100,000), and crosslinking density to achieve a balance where the dye provides color uniformity while the modified polymer matrix maintains heat resistance up to 200°C and chemical resistance to developers.
2Productivity
If exposure time is reduced to improve productivity, then yield per unit time increases, but sensitivity and developability deteriorate
Solution Approach 1:
The patent uses photopolymerization initiators with optimized absorption coefficients and quantum efficiencies, along with resin compositions having specific molecular weights and functional group densities, to achieve high sensitivity that allows reduced exposure times while maintaining clear development and pattern definition.
Solution Approach 2:
The patent enables rapid photopolymerization that completes curing in shorter exposure times, allowing the coating process to proceed faster without sacrificing the quality of development. The crosslinking reaction rapidly forms a stable network that prevents pattern breakdown during development.
3Volume of moving object
If coating film thickness is increased to 3 μm or more, then coverage and adhesion are improved, but development time and sensitivity requirements increase
Solution Approach 1:
The patent creates a segmented or gradient crosslinked structure where the polymer network forms at different rates and densities through the film thickness, enabling uniform development across the entire 3-10 μm thickness range. The composition allows light penetration and reaction throughout the thick film while maintaining pattern definition.
Solution Approach 2:
The patent adjusts resin molecular weight, functional group concentration, and photoinitiator loading to optimize the curing kinetics and development characteristics for thick film applications, achieving both adequate coverage at 3+ μm thickness and reasonable development speeds for productivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The polymer compound improves heat resistance, solubility, and chemical resistance, enabling better coating uniformity and developability, thereby addressing the limitations of traditional curable resin compositions and enhancing the performance of applications like LCD color filters and organic light-emitting diodes.
Implementation Method 1
a photopolymerization initiator and a solvent... may be polymerized and cured by light irradiation
Data Source
AI summary
The present invention relates to a polymer compound including a dye, and a curable resin composition including the same. The polymer compound including the dye according to the present invention may exhibit characteristics such as excellent heat resistance, solubility, coating uniformity, chemical resistance and the like by introducing a single molecule type dye into a side chain of a polymer binder to be modified into a polymer form and applying the modified polymer to a curable composition.