Dynamic Adhesive Composition for POLED Panel Bonding
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Solution Overview
Problem
Adhesive sheets with high initial adhesive strength pose challenges in removing bubbles and foreign substances during bonding, and require re-adhesion, which is difficult, especially when dealing with plastic organic light emitting diodes (POLEDs), as they can damage the panel and increase adhesive strength over time.
Innovation Solution
An adhesive composition comprising a (meth)acrylate-based resin and a polymer with a melting temperature of 45° C. or higher, formed by copolymerizing monofunctional polysiloxane with two or more types of monomers, providing low initial adhesive strength that increases after a specific process, ensuring sufficient strength for fixing the base without damaging the panel.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If an adhesive sheet with high adhesive strength is used from the beginning, then sufficient adhesive strength for fixing the base is obtained, but bubbles and foreign substances cannot be easily removed and re-adhesion becomes difficult
Solution Approach 1:
The adhesive sheet's adhesive strength is made dynamic rather than static. It starts with low adhesive strength to allow easy removal and bubble elimination, then transforms to high adhesive strength after a specific process (such as heating or UV irradiation) to provide sufficient fixing strength. This dynamic transformation resolves the contradiction between ease of operation and strength.
Solution Approach 2:
The adhesive composition changes its physical or chemical parameters (such as viscosity, molecular weight, or crosslinking degree) in response to external conditions. Initially, the adhesive maintains low strength characteristics, and after exposure to specific conditions (temperature, light, etc.), the parameters change to achieve high adhesive strength, thereby resolving the contradiction between removability and fixation strength.
2Strength
If an adhesive sheet with high adhesive strength is used, then sufficient adhesive strength for fixing the base is obtained, but the panel may be damaged during removal
Solution Approach 1:
The adhesive strength dynamically adjusts based on process requirements. During initial application and removal stages, the adhesive maintains low strength to prevent panel damage. After the specific process is completed, the adhesive transforms to high strength to ensure proper fixation, thus eliminating the harmful effect of panel damage while maintaining necessary strength.
Solution Approach 2:
The adhesive is designed to perform preliminary action with low strength during the application and adjustment phases, allowing easy removal and repositioning without damaging the panel. The high strength characteristic is activated only after the specific process, when the adhesive is no longer needed to be removed, thereby preventing panel damage during critical early stages.
3Ease of operation
If an adhesive sheet with low initial adhesive strength is used, then easy removal and bubble elimination are achieved, but sufficient adhesive strength for fixing the base is not obtained
Solution Approach 1:
The adhesive composition undergoes parameter changes triggered by external stimuli (such as temperature increase, UV irradiation, or chemical exposure). The parameters transition from a state providing low adhesive strength and high removability to a state providing high adhesive strength and stable fixation, thereby resolving the contradiction between ease of operation and sufficient strength.
Solution Approach 2:
The adhesive material experiences a phase transition (such as from liquid to gel, or from uncrosslinked to crosslinked state) that fundamentally changes its adhesive properties. Before the transition, the adhesive remains soft and removable; after the transition, it becomes firm and strongly adhesive, thus resolving the contradiction between ease of removal and fixation strength.
4Ease of operation
If a pressure-sensitive adhesive with groove structure is used, then bubbles are readily removed, but the adhered area decreases and sufficient adhesive strength cannot be obtained
Solution Approach 1:
The groove structure, which causes reduced adhered area, is extracted or eliminated from the adhesive composition. Instead of relying on physical grooves for bubble removal, the invention uses the dynamic adhesive strength characteristic to allow easy removal and bubble elimination while maintaining full contact area for strong adhesion after the specific process.
Solution Approach 2:
Rather than using structural modifications (grooves) to facilitate bubble removal, the invention changes the adhesive parameter (strength) over time. The adhesive maintains low strength during application to allow easy bubble elimination across the entire surface, then transforms to high strength to provide sufficient adhesion without requiring reduced contact area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive composition maintains low initial adhesive strength for easy removal and increases to sufficient levels post-process, preventing damage and ensuring strong fixation, while maintaining stability and variable characteristics for effective use in POLEDs.
Implementation Method 1
a polymer having a melting temperature (Tm) of 45° C. or higher
Implementation Method 2
the polymer is a copolymer of a monofunctional polysiloxane and two or more types of monomers
Data Source
AI summary
An adhesive composition, an adhesive film comprising the same, a backplate film comprising the adhesive film, and a plastic organic light emitting display comprising the adhesive film are provided. The adhesive composition includes a (meth)acrylate-based resin, and a polymer having a melting temperature (Tm) of 45° C. or higher, wherein the polymer is a copolymer of a monofunctional polysiloxane and two or more types of monomers.