Dynamic Beam Tracking for Semiconductor Metrology
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Solution Overview
Problem
Current semiconductor metrology and inspection methods require complex discrete movements and significant time for characterizing multiple targets, as incident beams need to remain stationary while targets are moved under them, which is inefficient.
Innovation Solution
The method involves directing an incident beam continuously along with the movement of semiconductor targets, allowing the beam to 'escort' the targets as they move between positions, ensuring continuous data collection for characterization, such as overlay errors or film thickness, using synchronized illumination and detection systems.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If discrete movements are used to move targets under a stationary incident beam, then measurement precision can be maintained, but productivity decreases and time consumption increases
Solution Approach 1:
Instead of moving targets under a stationary beam, the patent inverts the approach by making the incident beam move with the targets. The beam delivery system is coupled to the wafer stage to dynamically track and illuminate moving targets, allowing continuous measurement without discrete stopping and positioning operations.
Solution Approach 2:
The patent transitions from a static measurement configuration to a dynamic one. The incident beam system dynamically adjusts its position and orientation to follow targets as they move through the measurement field, enabling continuous measurement during target motion rather than requiring targets to be stationary.
2Measurement precision
If discrete movements with acceleration and deceleration are used, then targets can be positioned for measurement, but time consumption increases
Solution Approach 1:
The patent eliminates idle time during target transitions by maintaining continuous measurement action. As targets move continuously through the measurement field, the incident beam continuously tracks and measures them, removing the stop-start nature of discrete positioning and enabling uninterrupted measurement throughout the entire target sequence.
3Measurement precision
If complex acceleration and deceleration mechanisms are used for discrete movements, then targets can be precisely positioned, but device complexity increases
Solution Approach 1:
The patent replaces complex mechanical positioning and control systems with a synchronized optical tracking system. Instead of using sophisticated acceleration and deceleration mechanisms to position targets, the system uses beam delivery mechanisms that optically track moving targets, substituting mechanical complexity with optical-dynamic coordination.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the time and complexity of target characterization by maintaining continuous data collection during target movement, enhancing efficiency and accuracy in determining target characteristics.
Implementation Method 1
an output beam scattered from the first target, in response to the incident beam being directed towards the first target
Data Source
AI summary
Disclosed are apparatus and methods for inspecting or measuring one or more semiconductor targets. An incident beam is directed towards a first target as the first target substantially, continuously moves such that the incident beam remains directed at such first target during a first time period in which the first target substantially, continuously moves between a first position and a second position. An output beam scattered from the first target, in response to the incident beam being directed towards the first target during the first time period in which the first target substantially, continuously moves between the first and second positions, is detected such that information is obtained from the detected output beam during the first time period. The first time period is selected so that the information that is collected from the detected output beam during such first time period can be used to determine a characteristic of the first target.