Dynamic Bond Finger Placement for 3D IC Routing
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Solution Overview
Problem
Conventional wirebonding techniques struggle with dynamic placement and adjustment of bond fingers on IC packages, particularly in 3D routing scenarios, leading to design issues like wirebond-related shorts due to limitations in auto-routing technologies that are primarily designed for 2.5D problems.
Innovation Solution
A method and system for dynamic placement and adjustment of bond fingers that allows user-selected placement, identifies affected bond fingers and wires, and adjusts them based on clearance rules along arbitrary paths, utilizing an API and XML format for design reuse and interactive user control, enabling flexible handling of complex designs with power and ground rings, holes, and splits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Extent of automation
If conventional auto-routing technologies are used for 2.5D wirebonding, then routing computation is automated, but the system cannot handle 3D routing problems and bond wire flexing/bending in space
Solution Approach 1:
The patent extends conventional 2.5D auto-routing technologies into full 3D space by introducing z-axis coordinates and 3D spatial calculations. The system now computes bond wire paths in three dimensions, accounting for bond wire height variations and spatial relationships between bond fingers on different package layers, thereby enabling 3D routing capability while maintaining automation.
Solution Approach 2:
The patent introduces dynamic adjustment mechanisms that allow the system to adapt to bond wire flexing and bending during manufacturing. The routing computation dynamically adjusts bond wire paths based on simulated flexing patterns and spatial constraints, making the automated system versatile enough to handle real-world 3D manufacturing variations.
2Manufacturing precision
If batch-driven pattern cleanup with user-entered control values is used, then pattern refinement can be performed, but the process requires trial and error and is time-consuming
Solution Approach 1:
The patent pre-computes optimal bond finger placements and bond wire paths using 3D routing algorithms before the actual wirebonding process. By performing preliminary 3D routing computation that anticipates manufacturing constraints and spatial conflicts, the system eliminates the need for time-consuming trial-and-error pattern refinement during production.
Solution Approach 2:
The patent implements a feedback mechanism where the 3D routing computation continuously evaluates bond wire paths against clearance rules and spatial constraints. The system provides real-time feedback on potential conflicts and automatically adjusts placements, replacing manual trial-and-error refinement with automated iterative optimization.
3Extent of automation
If highly customizable placement rules and parameters are used for automatic initial generation, then pattern generation is automated, but the user interface becomes cumbersome with high levels of tweaking
Solution Approach 1:
The patent creates a universal 3D routing system that handles multiple wirebonding scenarios (different package types, bond finger configurations, and routing patterns) through a single automated framework. The system provides default 3D routing parameters that work across various designs, reducing the need for extensive customization while maintaining automation capability.
Solution Approach 2:
The patent enables the system to automatically configure and optimize 3D routing parameters based on the specific design requirements without requiring extensive user intervention. The automated initial generation process self-adjusts placement rules and parameters, making the user interface simpler while maintaining high automation.
4Device complexity
If conventional 2.5D auto-routing is used, then orthogonal movement in z-axis is limited, but the system cannot handle arbitrary paths and complex designs with holes and splits
Solution Approach 1:
The patent transitions from 2.5D to full 3D routing by introducing complete spatial freedom in all three axes. The system now supports arbitrary 3D paths between bond fingers, enabling complex routing around holes, splits, and obstacles on package substrates while maintaining ease of operation through automated path computation.
Data Source
AI summary
Various embodiments of the present invention relate to a method, system, and computer program product for dynamic placement of various bond fingers on an integrated circuit (IC) package. This is achieved by determining the placement of selected bond fingers. Subsequently, bond fingers and bond wires are identified, which have been affected due to the placement of the selected bond fingers. Further, the placement of the selected and the affected bond fingers is determined based on clearance rules and the affected bond fingers and bond wires. This facilitates the dynamic placement of the various bond fingers in interaction with the user. Further, the user is provided with full interactive access and control over the method and system.