Dynamic Bonding Alignment for Substrate Deformation Control
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Solution Overview
Problem
Existing bonding technologies fail to accurately bond a second object to a first object when the substrate position changes or deforms during the bonding process, leading to incorrect placement of dies on the substrate.
Innovation Solution
A bonding apparatus and method that includes a scope for measuring the position of selected regions, a bonding mechanism for precise bonding, and a controller that decides and re-executes the decision process based on the bonding situation to ensure accurate alignment and bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the substrate position is measured once before bonding, then the initial alignment is achieved, but the substrate position may change or deform during bonding causing incorrect die placement
Solution Approach 1:
The system implements continuous feedback by repeatedly measuring the substrate position during the bonding process. The controller obtains updated position information at multiple stages (before bonding, during bonding, and after bonding) and uses this feedback to dynamically adjust the bonding process, ensuring accurate die placement even when substrate deformation occurs
Solution Approach 2:
The system transitions from static single-time measurement to dynamic multi-stage measurement. The measurement process adapts to changing substrate conditions by performing measurements at different stages of the bonding process, allowing the system to respond to real-time substrate position changes and deformation
2Productivity
If the substrate position changes during bonding, then the bonding process continues, but the die cannot be bonded to the correct position on the substrate
Solution Approach 1:
The controller continuously monitors substrate position during bonding and uses this feedback information to adjust the bonding process in real-time, maintaining both process continuity and placement precision
Solution Approach 2:
The system performs preliminary measurements of substrate position before bonding begins, and also performs measurements during bonding to detect position changes. This preliminary and ongoing measurement approach allows the system to prepare for and respond to position changes while maintaining bonding accuracy
Data Source
AI summary
A bonding apparatus that executes a bonding process of bonding a second member to a plurality of regions of a first member, comprising a scope, a bonding mechanism configured to bond each of a plurality of second members to one of the plurality of regions, and a controller configured to execute a decision process of deciding positions of the plurality of regions by measuring, using the scope, a position of a selected region among the plurality of regions and control the bonding process based on the positions of the plurality of regions. The controller decides to re-execute the decision process in accordance with a situation of the bonding process.