Dynamic Clamping Force Control for Circuit Board Mounting
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Solution Overview
Problem
Existing electronic component mounting machines apply a constant maximum clamping force to circuit boards of varying weights, risking damage to lighter boards, increasing power consumption, and requiring excessive mechanical strength in conveyors, leading to higher manufacturing costs.
Innovation Solution
An electronic component mounting machine with a board clamp device that adjusts clamping force based on acquired circuit board information, including weight and material, to ensure appropriate clamping force, reducing the risk of damage, energy consumption, and mechanical stress on conveyors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a constant maximum clamping force is applied to ensure stable clamping of the heaviest circuit board, then the clamping stability is improved, but the circuit board may crack or be damaged due to excessive clamping force
Solution Approach 1:
The clamping force is made dynamic rather than constant. The control device adjusts the clamping force based on the actual weight of each circuit board, raising or lowering the clamp member to achieve appropriate clamping force for each board weight, thereby preventing damage while maintaining stability
Solution Approach 2:
The clamping force parameter is changed according to the circuit board weight. By acquiring board weight information and corresponding to it with appropriate clamping force values, the system optimizes the clamping force parameter to avoid both insufficient clamping and excessive force that causes damage
2Reliability
If maximum clamping force is always applied to ensure stable clamping, then the clamping reliability is improved, but the power consumption of the drive source increases
Solution Approach 1:
The clamping force application is made dynamic based on actual needs. The control device determines the appropriate clamping force for each circuit board weight and adjusts the clamp member position accordingly, applying only the necessary force rather than always maximum force, thus reducing power consumption while maintaining reliability
Solution Approach 2:
The clamping force parameter is optimized based on circuit board weight. By corresponding each board weight with an appropriate clamping force value, the system avoids unnecessary high power consumption associated with maximum clamping force while ensuring sufficient clamping reliability
3Reliability
If maximum clamping force is applied repeatedly to lighter circuit boards, then the clamping effectiveness is improved, but the mechanical strength and durability requirements of the conveyor increase
Solution Approach 1:
The clamping force applied to the conveyor is made dynamic rather than constantly maximum. By adjusting the clamp member position based on circuit board weight, the system applies only the necessary clamping force, reducing repeated maximum load impacts on the conveyor and extending its durability
Solution Approach 2:
The clamping force parameter is optimized according to circuit board weight. By corresponding each board weight with an appropriate clamping force, the system reduces unnecessary high forces transmitted to the conveyor, lowering mechanical stress and improving conveyor durability
Data Source
AI summary
An electronic component mounting machine including a board clamp device configured to clamp a circuit board conveyed by a conveyor by sandwiching side edge sections of the circuit board between a clamp member from below and a conveyor rail from above by raising the clamp member, the electronic component mounting machine being configured to mount electronic components on the circuit board clamped by the board clamp device; and a control device configured to control a clamping force that is a sandwiching force on the side edge sections of the circuit board sandwiched between the clamp member and the conveyor rail of the board clamp device. The control device is configured to acquire board information including at least a weight of the circuit board and to control the clamping force of the board clamp device based on the acquired board information.