Dynamic Cleaning Control for Substrate Processing Chamber
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Solution Overview
Problem
Substrate processing systems face inefficiencies in cleaning chambers due to unnecessary cleaning treatments when particle adherence is low and unsuitable cleaning treatments when processing types differ between lots, leading to inappropriate cleaning conditions.
Innovation Solution
A method that sets predetermined execution times and types of cleaning treatments based on the processing types and accumulation of processing times across lots, ensuring cleaning treatments are executed when adherence reaches a threshold and are suited to the immediate preceding processing type, with options for adjusting timing and frequency based on processing similarities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If cleaning treatment is executed at least once per lot regardless of particle adherence amount, then chamber cleanliness is maintained, but processing efficiency is reduced due to unnecessary cleaning operations
Solution Approach 1:
The system changes the parameter of cleaning frequency from fixed (at least once per lot) to variable (based on accumulated particle adherence amount). The controller monitors particle adherence dynamically and adjusts cleaning execution timing accordingly, performing cleaning only when the accumulated amount reaches a predetermined threshold, thus eliminating unnecessary cleaning operations while maintaining chamber cleanliness.
Solution Approach 2:
The system implements feedback by continuously monitoring the particle adherence amount on chamber components and using this information to determine when cleaning is necessary. The controller receives feedback on particle accumulation levels and adjusts cleaning treatment execution based on this feedback, creating a closed-loop control system that optimizes cleaning frequency.
2Ease of operation
If cleaning treatment type is set beforehand for each chamber, then cleaning operation is simplified, but cleaning effectiveness is reduced when processing types differ between lots
Solution Approach 1:
The system transitions from a static cleaning approach (fixed cleaning type set beforehand) to a dynamic approach where the cleaning treatment type is selected based on the actual processing history. The controller dynamically determines the appropriate cleaning type by analyzing the types of processing performed in previous lots, ensuring the cleaning method matches the deposited materials while maintaining operational simplicity through automated selection.
Solution Approach 2:
The system changes the parameter of cleaning treatment type from fixed to variable, selecting different cleaning types (such as plasma cleaning, chemical cleaning, or mechanical cleaning) based on the accumulated processing history. The controller adjusts the cleaning parameters according to the detected particle adherence characteristics and processing types, optimizing cleaning effectiveness for different material deposits.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures the chamber is cleaned in appropriate conditions, reducing unnecessary cleaning and maintaining chamber cleanliness by aligning cleaning treatments with actual particle adherence and processing types, thereby enhancing processing efficiency and reducing frequency.
Implementation Method 1
a cleaning gas is introduced into the chamber, plasma is generated from the cleaning gas, and particles, etc. adhered to the interior of the chamber are etched by the plasma
Data Source
AI summary
A cleaning method for a substrate processing system capable of appropriately cleaning a housing chamber. In the substrate processing system, the number of execution times of product processing is accumulated, if the product processing to be executed next corresponds to first product processing for a subsequent lot, a time interval between preceding and subsequent lots is not longer than a predetermined time period, and a type of the last product processing performed for the preceding lot is the same as that of the first product processing to be performed for the subsequent lot. When the accumulated number of execution times is not less than a predetermined number of times, a cleaning treatment is executed, which corresponds to a chamber indicated in a system recipe set for a lot including a wafer on which the product processing is performed immediately before execution of the cleaning treatment.