Dynamic Clock Frequency Control for Semiconductor Thermal Management
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
High-performance electronic devices with high-speed processors generate excessive heat, leading to potential operational abnormalities and user safety issues, while reducing processor speed compromises data processing capacity.
Innovation Solution
A temperature control method that measures the temperature of a semiconductor chip, adjusts the clock frequency based on varying target temperatures over time, and dynamically manages heat through a temperature management table to maintain optimal operating conditions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the processor operates at a high speed, then data processing capacity is improved, but heat generation increases
Solution Approach 1:
The patent implements dynamic temperature control by continuously monitoring processor temperature and adjusting the clock frequency in real-time. The system transitions from static frequency operation to dynamic adjustment, allowing the processor to operate at high speeds when cool and reduce frequency when temperature rises, thus resolving the contradiction between maintaining high data processing capacity and controlling heat generation.
Solution Approach 2:
The system changes the operating parameter (clock frequency) based on temperature conditions. When temperature exceeds thresholds, the clock frequency is reduced; when temperature is within acceptable ranges, the frequency is increased or maintained. This parameter adjustment strategy allows the system to optimize both performance and thermal management.
2Temperature
If the operating speed of the processor is lowered, then heat generation is reduced, but data processing capacity declines
Solution Approach 1:
The patent employs periodic temperature monitoring and frequency adjustment cycles. Rather than maintaining a constantly reduced frequency, the system periodically checks temperature and only reduces frequency when necessary. This periodic action allows the processor to maintain high speed during cool periods while still providing thermal protection when needed, thus minimizing the impact on overall data processing capacity.
Solution Approach 2:
The system implements a feedback mechanism where temperature sensors continuously monitor processor temperature and feed this information back to the clock frequency control unit. Based on this feedback, the system makes intelligent decisions about frequency adjustment, ensuring that speed reduction occurs only when thermally necessary, thereby maintaining optimal data processing capacity while managing heat generation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively balances data processing capacity and temperature control, preventing overheating while maintaining efficient operation by dynamically adjusting clock frequencies in response to temperature variations.
Implementation Method 1
measuring a temperature of a measurement point using the electronic device
Implementation Method 2
If a processor operates at a high speed, generally, heat generation of the electronic device may increase
Data Source
AI summary
A method for controlling a temperature of an electronic device which includes a semiconductor chip is provided. The temperature control method includes measuring a temperature of a measurement point using the electronic device, comparing the temperature of the measurement point with a target temperature varying according to a period of time when the semiconductor chip operates using the electronic device, and decreasing a clock frequency of the semiconductor chip using the electronic device when the temperature of the measurement point is higher than the target temperature.