Dynamic Cooling Control for Cluster Processing Devices
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Data centers face inefficiencies in cooling resource allocation due to performance variations among processing devices, leading to increased costs and power consumption, as the latency of the cluster is driven by the slowest machine, and existing cooling methods do not effectively address these variations.
Innovation Solution
A dynamic cooling system that individually controls each processing device within a cluster, determining performance targets and adjusting cooling delivery based on device performance, allocating more resources to under-performing devices and reducing resources for over-performing ones without impacting overall performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If uniform cooling is applied to all processing devices in a cluster, then all devices are maintained at optimal temperature, but cooling resources are wasted on over-performing devices and under-performing devices cannot achieve sufficient cooling
Solution Approach 1:
The patent applies local quality by transitioning from uniform cluster-wide cooling to device-specific cooling control. Each processing device receives customized cooling based on its individual performance characteristics, allowing under-performing devices to receive enhanced cooling while over-performing devices receive reduced cooling, thereby optimizing overall cooling resource allocation.
Solution Approach 2:
The patent segments the cooling control system into individual device-level controllers rather than a centralized uniform cooling approach. This segmentation enables independent performance monitoring and cooling adjustment for each processing device, allowing precise targeting of cooling resources to devices that need them most.
2Speed
If cooling resources are increased for under-performing devices to improve their speed, then their performance increases, but overall power consumption increases
Solution Approach 1:
The patent implements dynamic cooling control where cooling resources are continuously adjusted based on real-time performance monitoring. Under-performing devices receive increased cooling dynamically when needed to boost their speed, while over-performing devices have cooling reduced, creating a dynamic balance that optimizes performance per unit energy consumed.
Solution Approach 2:
The patent changes the cooling parameter allocation from a static uniform distribution to a dynamic performance-based distribution. By monitoring performance metrics and adjusting cooling parameters accordingly, the system increases cooling to under-performing devices to improve speed while simultaneously reducing cooling to over-performing devices to decrease overall power consumption.
3Loss of energy
If cooling is reduced for over-performing devices to save resources, then cooling resource allocation improves, but device temperature increases
Solution Approach 1:
The patent employs feedback mechanisms where performance metrics from each device are continuously monitored and fed back to the cooling control system. This feedback loop allows the system to detect when a device is over-performing and automatically reduce its cooling allocation, while simultaneously detecting under-performing devices that need increased cooling, thereby optimizing resource allocation without compromising necessary temperature control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances overall cluster performance by optimizing cooling resource allocation, reducing power consumption and costs, while maintaining cluster performance by focusing on under-performing devices and de-allocating resources from over-performing ones without significant performance degradation.
Implementation Method 1
The reduction in temperature reduces leakage current and enables the processing device to run at a higher frequency than it could otherwise run at a higher temperature
Data Source
AI summary
Methods, systems, and apparatus for cooling control in a datacenter. In one aspect, a method includes, for each processing device in a cluster of processing devices configured to perform a distributed task, wherein each processing device is thermally controlled by a cooling system that controls cooling to each processing device on an individual basis, determining whether the processing device is operating within a performance target for the cluster of processing devices; for each processing device determined to not be operating within the performance target for the cluster, generating a respective control signal to adjust the cooling delivery to the processing device to cause the performance of the processing device to be within the performance target for the cluster of processing devices; and for each processing device determined to be operating within the performance target for the cluster, maintaining the cooling delivery to the processing device.