Dynamic Cooling Recipe Selection for Semiconductor Substrate Uniformity
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Solution Overview
Problem
The uniformity of processing in semiconductor device manufacturing is compromised due to temperature differences between substrates processed in different chambers, leading to variations in thermal history and cooling times, which can cause delays and inconsistencies in the transfer sequence.
Innovation Solution
A substrate processing system that includes a vacuum transfer chamber and a loadlock chamber, where substrates are cooled using an inert gas supply system, allowing for precise temperature control and uniform cooling based on pre-determined recipes, thereby standardizing the cooling process across all substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If substrates are cooled using a fixed cooling recipe regardless of temperature, then the cooling process is simple to operate, but processing uniformity deteriorates due to temperature differences between substrates
Solution Approach 1:
The cooling recipe is made dynamic by selecting different cooling parameters based on the measured temperature of each substrate. The system transitions from a static fixed-recipe approach to a dynamic adaptive approach where cooling conditions change according to substrate temperature, thereby achieving uniform processing results without excessive complexity.
Solution Approach 2:
The cooling parameters (such as gas flow rate, cooling duration, or temperature setpoints) are changed based on the substrate temperature measurement. By adjusting these parameters according to the actual temperature state, the system achieves consistent cooling results across substrates with different initial temperatures, improving processing uniformity.
2Productivity
If substrates are cooled without temperature-based recipe selection, then the cooling process is fast and simple, but delays occur due to inconsistent cooling times
Solution Approach 1:
Multiple cooling recipes are prepared in advance, each optimized for different temperature ranges. The system measures the substrate temperature and selects the appropriate pre-prepared recipe, avoiding the need for real-time iterative adjustments. This preliminary preparation of multiple recipes enables fast selection and execution, maintaining high cooling efficiency while eliminating transfer delays.
Solution Approach 2:
The cooling process becomes dynamic by adapting the recipe selection to the actual substrate temperature. This dynamic approach ensures that each substrate receives the appropriate cooling treatment for its temperature level, optimizing cooling time for each case and preventing delays in the transfer sequence while maintaining overall productivity.
3Manufacturing precision
If different cooling times are used for substrates with different temperatures, then processing uniformity is improved, but the transfer sequence becomes complex and delayed
Solution Approach 1:
Multiple cooling recipes with different time parameters are prepared in advance for different temperature ranges. The system quickly selects the appropriate pre-calculated recipe based on substrate temperature, avoiding real-time time adjustments. This preliminary preparation of temperature-specific recipes achieves uniform thermal history while minimizing transfer sequence delays through fast recipe selection rather than sequential adjustment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures consistent processing uniformity by standardizing cooling times and temperatures across substrates, reducing delays and enhancing the overall efficiency of the semiconductor device manufacturing process.
Implementation Method 1
cooling the substrate accommodated in the loadlock chamber by supplying an inert gas to the substrate accommodated in the loadlock chamber according to a cooling recipe
Data Source
AI summary
The present disclosure provides a technique including a method of manufacturing a semiconductor device, which is capable of improving a processing uniformity of a plurality of substrates. The method may include: (a) subjecting a substrate accommodated in one of a plurality of process chambers to a thermal process: (b) transferring the substrate processed in (a) by a transfer robot provided in a vacuum transfer chamber connected to the plurality of process chambers from the one of a plurality of process chambers to a loadlock chamber connected to the vacuum transfer chamber; and (c) cooling the substrate accommodated in the loadlock chamber by supplying an inert gas to the substrate accommodated in the loadlock chamber according to a cooling recipe.