Dynamic Covalent Thermoset Nanocomposite E-Skin

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Current electronic skins (e-skins) lack sufficient mechanical strength, chemical stability, and are not fully recyclable, reprocessable, or reshapable, limiting their practical applications in robotics, prosthetics, and healthcare.

Innovation Solution

A dynamic covalent network polymer composition incorporating exchangeable linkages and electrically conductive particles, such as silver nanoparticles, forms a self-healing, recyclable, and malleable e-skin that can detect various stimuli, including tactile pressure, temperature, and humidity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If conventional e-skin materials are used, then sensing capabilities are achieved, but mechanical strength and chemical stability are insufficient

Engineering Contradiction:
Improvemechanical strengthVSAvoidchemical stability
Core Design Contradiction:
StrengthVSReliability

Solution Approach 1:

The patent employs a composite material system consisting of a dynamic covalent network polymer matrix combined with electrically conductive particles (such as silver nanoparticles, carbon nanotubes, or graphene). This composite structure provides both mechanical strength from the polymer network and electrical conductivity from the dispersed particles, resolving the contradiction between achieving sensing capabilities and maintaining sufficient mechanical strength and chemical stability.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent utilizes dynamic covalent linkages (such as disulfide bonds, imine bonds, or boronic ester bonds) that can reversibly change their bonding parameters in response to external stimuli. This dynamic parameter change enables the material to maintain structural integrity under normal conditions while allowing self-healing when damaged, thereby improving both mechanical strength and chemical stability simultaneously.

Inventive Principle:
Principle #35Parameter changes

2Ease of manufacture

If conventional e-skin formulations are used, then sensing functionalities are integrated, but recyclability and reprocessability are not achieved

Engineering Contradiction:
ImproverecyclabilityVSAvoidfunctional integrity
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent employs dynamic covalent chemistry where the polymer network contains reversible bonds that can break and reform under specific conditions. This dynamic character allows the e-skin to be recycled and reprocessed by breaking the covalent bonds, while the functional integrity is restored when the bonds reform during the recycling process, maintaining sensing capabilities.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The patent enables the e-skin to be discarded in a controlled manner through bond cleavage under specific stimuli (such as pH change, temperature, or chemical treatment), and the material components can be recovered and reused to fabricate new e-skin devices, achieving full recyclability while maintaining functional integrity.

Inventive Principle:
Principle #34Discarding and recovering

3Reliability

If self-healing capabilities are added to e-skins, then durability is improved, but mechanical strength may be compromised

Engineering Contradiction:
ImprovedurabilityVSAvoidmechanical strength
Core Design Contradiction:
ReliabilityVSStrength

Solution Approach 1:

The patent implements self-service functionality through self-healing mechanisms where the e-skin automatically repairs its own damage without external intervention. The dynamic covalent bonds in the polymer matrix can spontaneously break and reform to close cracks or defects, improving durability while the distributed network structure maintains overall mechanical strength.

Inventive Principle:
Principle #25Self-service

Solution Approach 2:

The patent incorporates redundant bonding pathways and crosslinked network structures that provide mechanical support before damage occurs. When damage happens, the pre-existing dynamic bonds can rapidly reform to cushion the structural failure, maintaining both durability and mechanical strength simultaneously.

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides an e-skin with enhanced mechanical strength, chemical stability, and recyclability, enabling it to heal and reshape while maintaining sensing capabilities, making it suitable for diverse applications in robotics, prosthetics, and healthcare.

Implementation Method 1

at least one dynamic covalent network polymer comprising at least one exchangeable dynamic covalent linkage selected from the group consisting of a disulfide linkage, an imine linkage, a thioester linkage, an acyl hydrazine linkage, a boronic ester linkage, an alkene linkage, an alkyne linkage, an ester linkage, a carbamate linkage and a urea linkage

Methodology Applied
Scientific EffectDynamic covalent bonding: Chemical Bonding

Implementation Method 2

the composition comprises at least one electrically conductive particle... wherein the particle comprises at least one material selected from the group consisting of metal, liquid metal, metal oxide, metalloid, and carbon

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS11518840B2Dynamic covalent thermoset nanocomposites and uses thereof
Publication Date: 2022.12.06 THE REGENTS OF THE UNIVERSITY OF COLORADO
  • US11518840B2 patent drawing
  • US11518840B2 patent drawing
  • US11518840B2 patent drawing

AI summary

In one aspect, the invention provides a healable, recyclable and malleable e-skin. In certain embodiments, the e-skin comprises sensors that can detect at least one applied stimulus. In other embodiments, the e-skin comprises a dynamic covalent thermo set doped with a nano-particle composition, thereby rendering the doped thermoset conductive. The e-skin of the invention has potential applicability to the fields of robotics, prosthetics, health monitoring, biomedical devices and consumer products.