Dynamic Encapsulation Heating for OLED Sealing
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Solution Overview
Problem
Current encapsulation processes for organic light-emitting display devices fail to meet stringent water-proof and oxygen-proof parameters due to fixed process parameters, leading to inadequate sealing caused by uneven frit thickness and location deviations during the heating and melting process.
Innovation Solution
An encapsulation system comprising a thickness detection unit, output control unit, and energy output unit, which detects and adjusts energy distribution based on actual frit thickness and location to ensure proper heating and melting, using a non-contact optical film thickness measuring instrument and a laser as the energy output unit.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If fixed process parameters are used for heating frit during encapsulation, then the encapsulation process can be simplified and operated easily, but the sealing quality deteriorates due to uneven frit thickness and location deviations
Solution Approach 1:
The patent applies dynamics by transitioning from fixed process parameters to dynamic parameter adjustment. The heating process continuously adapts to real-time feedback from thickness detection and location detection units, allowing the system to respond to variations in frit thickness and position. This dynamic adjustment ensures optimal heating for each specific condition, resolving the contradiction between operational simplicity and sealing quality.
Solution Approach 2:
The patent implements feedback control through thickness detection units and location detection units that monitor the frit state during heating. The detected information is fed back to the heating control unit, which adjusts heating parameters accordingly. This closed-loop feedback system maintains high sealing quality while keeping the operation straightforward, as the system automatically compensates for variations without requiring complex manual intervention.
2Productivity
If preset heating parameters are applied uniformly across the substrate, then the heating process can be completed quickly, but parts of the frit with different thicknesses or locations cannot be sufficiently melted
Solution Approach 1:
The patent applies local quality by providing differentiated heating to different regions of the substrate based on their specific needs. The heating control unit adjusts heating parameters locally according to thickness detection and location detection data, ensuring that thicker or deviated frit areas receive sufficient heat while thinner areas are not overheated. This localized approach maintains high productivity by avoiding unnecessary heating of already-sufficient areas while ensuring complete melting where needed.
Solution Approach 2:
The patent implements parameter changes by dynamically modifying heating parameters (temperature, time, power distribution) based on real-time detection of frit thickness and location. Instead of using uniform preset parameters, the system continuously adjusts heating parameters to match the actual state of the frit, ensuring complete and reliable melting across all areas while maintaining efficient processing speed.
3Device complexity
If the encapsulation process uses fixed parameters despite frit thickness variations, then the process can be standardized and easily controlled, but bubbles form in the frit and sealing is compromised
Solution Approach 1:
The patent applies self-service by enabling the encapsulation system to automatically detect and compensate for frit thickness variations and location deviations without external intervention. The thickness detection units and location detection units continuously monitor the frit state, and the heating control unit automatically adjusts parameters to prevent bubble formation and ensure proper sealing. This self-adjusting capability maintains standardized process control while achieving high sealing quality, eliminating the need for complex manual control procedures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This system effectively improves the sealing of organic light-emitting display devices by ensuring all frit at the to-be-heated location sufficiently melts, enhancing the product's water-proof and oxygen-proof performance.
Implementation Method 1
a thickness detection unit, configured to detect a thickness of an encapsulant at a to-be-heated location in a component to be encapsulated
Implementation Method 2
output, depending on the output control information, to the encapsulant at the to-be-heated location energy for heating and melting the encapsulant
Implementation Method 3
energy for heating and melting the encapsulant
Implementation Method 4
using a non-contact optical film thickness measuring instrument and a laser as the energy output unit
Data Source
AI summary
The present disclosure discloses an encapsulation system and an encapsulation method, the encapsulation system including a thickness detection unit, an output control unit and an energy output unit, the thickness detection unit being connected with the output control unit, and the output control unit being connected with the energy output unit. The thickness detection unit is configured to detect a thickness of an encapsulant at a to-be-heated location in a component to be encapsulated and generate corresponding thickness information. The output control unit is configured to generate corresponding output control information depending on the thickness information. The energy output unit is configured to output, depending on the output control information, to the encapsulant at the to-be-heated location energy for heating the encapsulant.