Dynamic Heat Conduction Block for Variable Component Heights
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Solution Overview
Problem
Traditional heat conduction systems for computer apparatus face issues such as high thermal resistance, increased costs due to the need for multiple devices for different electronic components, lack of buffering capacity leading to damage from external forces, and difficulty in maintaining close contact between heat conduction blocks and electronic components.
Innovation Solution
A dynamic heat conduction system comprising a base, heat conduction block, resilient unit, and securing units, where the heat conduction block is movable within the base and secured by units that allow for different heights and resilient coefficients to accommodate various electronic components, providing a buffering effect and improved thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a thermal pad is used to fill the gap between the heat conduction block and the processor, then the heat conduction block can contact the processor, but the thermal resistance increases and the buffering capacity is lost
Solution Approach 1:
The heat conduction block is designed with movable capability within the base, allowing it to dynamically adjust its position and apply optimal contact force to the processor. This dynamic adjustment eliminates the need for static thermal pads while maintaining reliable contact and minimizing thermal resistance through direct block-to-processor contact.
Solution Approach 2:
The system changes the contact parameter from indirect contact through thermal pad to direct contact between heat conduction block and processor. By adjusting the movable range and resilient force parameters, the system achieves both reliable contact stability and minimal thermal resistance without energy loss.
2Loss of energy
If the thickness of the thermal pad is decreased to reduce thermal resistance, then heat conduction improves, but the adaptability to different electronic component heights is lost
Solution Approach 1:
The heat conduction block's movable design enables it to adapt to different electronic component heights dynamically. The block can shift position within its movable range to maintain optimal contact with components of varying heights, eliminating the need for different thermal pad thicknesses while keeping thermal resistance low.
Solution Approach 2:
The heat conduction block serves multiple functions: it conducts heat, adjusts to different component heights, and maintains contact pressure. This universal design replaces the need for multiple specialized thermal pads of different thicknesses, achieving both low thermal resistance and height adaptability with a single component.
3Reliability
If traditional heat conduction structures with spring screws are used, then heat conduction is achieved, but the cost increases and assembly becomes difficult
Solution Approach 1:
The invention merges the heat conduction block, base, and resilient force mechanism into an integrated assembly. The block is directly mounted on the base with built-in resilient force, eliminating the need for separate spring screws and complex assembly steps. This unified structure maintains reliable heat conduction while significantly simplifying assembly.
Solution Approach 2:
The design extracts and eliminates unnecessary components like spring screws from the traditional heat conduction structure. By integrating the resilient force mechanism directly into the base-block assembly, the system achieves reliable heat conduction with fewer parts and simpler assembly procedures.
4Reliability
If heat pipes and spring screws are used to secure the heat conduction block, then heat conduction is improved, but the cost of components increases
Solution Approach 1:
The invention replaces expensive heat pipes and spring screws with a simpler, more cost-effective resilient force mechanism integrated into the base. This substitution maintains effective heat conduction while significantly reducing component costs, achieving the same thermal performance with cheaper materials.
Solution Approach 2:
The design removes expensive components like heat pipes and spring screws from the assembly. By extracting these high-cost elements and replacing them with a simplified resilient mounting structure, the system maintains reliable heat conduction while reducing overall component cost.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The dynamic heat conduction system effectively prevents damage from external forces, ensures close contact for efficient heat transfer, and simplifies the assembly process by accommodating different electronic component heights and shapes, thereby enhancing heat conduction performance and reducing manufacturing complexity.
Implementation Method 1
a resilient unit (120), having one end engaged with the base (110) and the other end engaged with the heat conduction block (130)
Implementation Method 2
The heat energy can be rapidly transferred from the electronic component to the heat conduction device by making the heat conduction block be closely contact to the electronic component
Data Source
Figure 1
Figure 2
Figure 3~4
AI summary
This invention provides a dynamic heat conduction system comprising a base, a resilient unit, a heat conduction block, and at least one securing unit. The base accommodates the resilient unit and the heat conduction block and the at least one securing unit secures at least a portion of the base and the resilient unit within the base. The heat conduction block comprises a heat conduction surface for forming a contact with an electronic device and accomplishes preferably efficient heat conduction by conducting the heat produced by the electronic device through the heat conduction surface, the heat conduction block, and a side surface of the heat conduction block to the base. Still, this invention provides a dynamic heat conduction system comprising a heat conduction board for accommodating a plurality of heat conduction blocks and a plurality of bases for forming a preferable heat conduction path with a plurality of electronic devices having different shapes or sizes.