Dynamic Heat Flow Calculation via 3D Thermography
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Solution Overview
Problem
Existing methods do not allow for a dynamic and accurate calculation of heat flow through a building enclosure, often resulting in inaccurate results.
Innovation Solution
A method and system that utilize a 3D scanner and a thermographic camera with known intrinsic and extrinsic parameters to obtain digital 3D maps and thermographic data of both interior and exterior sides of a building enclosure, enabling the calculation of heat flow based on temperature data and 3D points with corresponding thermographic data.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If static thermographic representation is obtained by combining 3D map and thermographic data, then a picture of heat flow is provided, but the result is not dynamic and lacks accuracy for heat flow calculation
Solution Approach 1:
The patent transforms the static thermographic representation into a dynamic heat flow calculation system. By continuously acquiring thermographic data from multiple positions and combining it with 3D geometric information, the system enables dynamic calculation of heat flow through building enclosures, allowing updates as new measurement data becomes available rather than relying on a single static picture.
Solution Approach 2:
The patent adds the temporal dimension to the existing 3D spatial representation by acquiring thermographic data from multiple positions over time. This multi-positional approach creates a four-dimensional dataset (x, y, z, t) that enables dynamic heat flow calculation, transforming the problem from static image analysis to dynamic thermal field reconstruction.
2Measurement precision
If more temperature measurement points are used to improve heat flow calculation accuracy, then measurement precision improves, but device complexity and measurement time increase
Solution Approach 1:
The patent makes the measurement system universal by using a single integrated platform that performs both 3D scanning and thermographic measurement. The mobile measurement platform carries both types of sensors, allowing one system to collect multiple data types (geometric and thermal) simultaneously, reducing overall system complexity while enabling comprehensive heat flow analysis.
Solution Approach 2:
The patent merges 3D scanning and thermographic measurement into a single integrated process. By combining these two measurement techniques on one mobile platform and processing them together through unified software, the system achieves high measurement precision without proportionally increasing device complexity, as the infrastructure and processing pipeline are shared.
3Measurement precision
If traditional static methods are used for heat flow analysis, then device complexity is low, but measurement precision and spatial resolution are insufficient
Solution Approach 1:
The patent implements continuous measurement by moving the measurement platform along the building enclosure and continuously acquiring thermographic data at multiple positions. This continuous data collection process, combined with real-time or near-real-time processing, provides comprehensive spatial coverage and high spatial resolution without requiring间断性 measurements, thereby improving both precision and efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables a more exact and dynamic calculation of heat flow with higher spatial resolution, providing more accurate results without the need for extensive temperature feelers or knowledge of building enclosure thickness.
Implementation Method 1
obtaining... thermographic data of the interior side of the at least part of the building enclosure... and thermographic data of the exterior side of the at least part of the building enclosure
Data Source
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AI summary
A method, a system, a computer program and a data carrier signal for obtaining a 3D thermographic representation of at least an exterior side of a building enclosure and for calculating heat flow through at least part of a building enclosure for at least part of the building enclosure based on a 3D thermographic representation of at least an exterior side of the building enclosure, at least one temperature of an interior environment and at least one temperature of an exterior environment.