Dynamic Heat Pipe Condenser Control for Variable Processor Loads

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Modern high-performance processors generate excessive heat due to increased power consumption, and existing heat pipes are not optimized for dynamic changes in workload, leading to suboptimal heat transfer efficiency across a wide range of power draws and heat generation levels.

Innovation Solution

A heat pipe system with a dynamically modifiable vapor path, incorporating vapor blocking devices that adjust the active heat transfer region within the condenser portion, allowing for real-time optimization of heat transfer by altering the effective heat transfer area and fill ratio, thereby enhancing heat dissipation in response to varying workload conditions.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If heat pipes are sealed at manufacturing with fixed heat transfer paths, then manufacturing simplicity is maintained, but adaptability to varying power demands is reduced

Engineering Contradiction:
Improveadaptability to varying power demandsVSAvoidheat pipe structure complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent applies the dynamics principle by introducing movable vapor blocking devices within the heat pipe chamber that can dynamically reposition to modulate heat transfer. The vapor blocking device is configured to move between different positions to adjust the active heat transfer region of the condenser portion, enabling the heat pipe to adapt to varying power demands of processors while maintaining a relatively simple sealed structure.

Inventive Principle:
Principle #15Dynamics

2Productivity

If the active heat transfer region is dynamically modified, then heat transfer efficiency is enhanced, but device complexity increases

Engineering Contradiction:
Improveheat transfer efficiencyVSAvoidheat pipe system complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The patent applies parameter changes by modifying the physical state and position of vapor blocking devices within the heat pipe chamber. By changing the position parameter of these devices, the active heat transfer region of the condenser portion is dynamically adjusted, thereby optimizing heat transfer efficiency under different operating conditions without requiring complete redesign of the heat pipe system.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables improved heat transfer efficiency by dynamically adjusting the heat transfer capabilities of heat pipes, effectively managing heat flux and thermal resistance across different workload levels, enhancing cooling performance and broadening the operational spectrum of heat sinks.

Implementation Method 1

Many of these known processors use one or more heat pipes affixed to the external surfaces of the processors as the heat sinks to remove the generated heat

Methodology Applied
Scientific EffectHeat pipe: Heat Pipe

Implementation Method 2

transferring at least a portion of the heat to at least a portion of a volatile fluid within one or more heat pipes

Methodology Applied
Scientific EffectPhase change: Phase Change

Implementation Method 3

Each heat pipe of the one or more heat pipes includes an outer shell and a wick structure coupled to the outer shell

Methodology Applied
Scientific EffectCapillary action: Capillary Action

Data Source

PatentUS20240426558A1Dynamically enhancing heat transfer through heat pipes
Publication Date: 2024.12.26 INTERNATIONAL BUSINESS MACHINE CORPORATION
  • US20240426558A1 patent drawing
  • US20240426558A1 patent drawing
  • US20240426558A1 patent drawing

AI summary

A heat pipe system, method, and heat sink system to enhance heat transfer from a heat-generating component. The method includes generating heat with the heat-generating component. The method also includes transferring at least a portion of the heat to at least a portion of a volatile fluid within one or more heat pipes. The method further includes modifying, dynamically, an active heat transfer region of the one or more heat pipes, thereby dynamically modulating heat transfer from the heat-generating component through the one or more heat pipes.