Dynamic Heating Plate Temperature Control for Semiconductor Substrate Processing

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Solution Overview

Problem

Current thermal processing methods for semiconductor substrates face challenges in reducing processing time without varying the characteristics of coated films between substrates, as they require large heating plates with slow temperature changes, leading to increased costs and potential decreases in heating plate strength.

Innovation Solution

A method where the heating plate temperature is changed before reaching the set temperature for the first substrate, with temperature data used to predict and adjust the heat quantity for subsequent substrates, allowing for thermal processing before the plate reaches the set temperature, and maintaining consistent processing conditions across substrates.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If the heating plate temperature is changed to reach the set temperature before processing, then the processing time can be shortened, but the heat quantity supplied to the substrate varies leading to inconsistent film characteristics

Engineering Contradiction:

Improveprocessing timeVSAvoidfilm characteristic consistency

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The heating plate temperature is preliminarily adjusted to a first set temperature before substrate processing begins. This preliminary action allows the heating plate to reach the required temperature state in advance, enabling shorter processing times while maintaining consistent heat supply to subsequent substrates through automated temperature control based on processing sequence detection

Inventive Principle:

Principle #10Preliminary action

2Reliability

If the heating plate size is increased to maintain temperature stability, then the temperature control improves, but the heating plate strength decreases and manufacturing costs increase

Engineering Contradiction:

Improvetemperature control stabilityVSAvoidheating plate strength

Core Design Contradiction:

ReliabilityVSStrength

Solution Approach 1:

The heating plate temperature control method changes from maintaining a constant high set temperature to dynamically adjusting the set temperature based on the processing sequence. By changing the temperature parameter strategy (using different set temperatures for different processing stages and substrates), the system achieves reliable temperature control without requiring an oversized heating plate, thereby preserving heating plate strength and reducing manufacturing costs

Inventive Principle:

Principle #35Parameter changes

3Ease of manufacture

If the heating plate temperature is reduced to maintain strength, then the manufacturing cost decreases, but the temperature control capability for consistent film characteristics deteriorates

Engineering Contradiction:

Improvemanufacturing costVSAvoidfilm characteristic consistency

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

The heating plate set temperature is made dynamic rather than static. The control device automatically adjusts the set temperature based on the detected processing sequence, allowing the temperature to vary appropriately for different substrates and processing stages. This dynamic temperature control maintains film characteristic consistency while enabling the use of smaller, stronger, and more cost-effective heating plates

Inventive Principle:

Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach shortens processing time while maintaining consistent film characteristics without compromising heating plate strength or increasing manufacturing costs, ensuring uniformity in the critical dimension of resist patterns.

Implementation Method 1

a heating plate set to a predetermined temperature... thermal processing of a substrate using the heating plate

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS8916804B2Heat treatment method, recording medium having recorded program for executing heat treatment method, and heat treatment apparatus

Publication Date: 2014.12.23 TOKYO ELECTRON LTD

AI summary

Provided is a thermal processing method including a first process comprising changing a set temperature of the heating plate from a first temperature to a second temperature; initiating a thermal processing for a first substrate before the temperature of the heating plate reaches the second temperature; obtaining temperature data of the heating plate after the thermal processing is initiated; changing the set temperature of the heating plate from the second temperature when the set temperature reaches the second temperature; and thermal processing of the first substrate using the heating plate for which the set temperature has been changed. The method further includes a second process comprising reinstating the temperature of the heating plate to the second temperature after the thermal processing of the first substrate; and thermal processing of a next substrate using the heating plate while the temperature of the heating plate is maintained at the second temperature.