Dynamic Impact Testing for IC Damage Thresholds
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Solution Overview
Problem
Pick and place machines used in integrated circuit manufacturing often cause invisible internal damage to devices due to impact during handling, which increases with smaller package sizes and faster manufacturing processes, and existing force measurement tools are static and ineffective in predicting damage to small dimension packages.
Innovation Solution
A dynamic impact testing device that applies and measures reproducible dynamic forces to integrated circuit devices, allowing for the determination of the threshold impact force that causes damage, using a ram assembly with adjustable mass and height to simulate production conditions and a load cell to quantify the force.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If static force measurement tools are used, then measurement simplicity is maintained, but they are ineffective in predicting damage to small dimension packages
Solution Approach 1:
The patent transitions from static force measurement to dynamic impact force measurement. The system uses a dynamic impact testing device that applies controlled impact forces to integrated circuit devices, measuring the actual dynamic forces during pick-and-place operations. This dynamic measurement approach accurately predicts damage to small dimension packages by capturing the transient nature of impact forces that static tools cannot detect.
2Productivity
If manufacturing processes are accelerated, then productivity increases, but the opportunity for impact damage increases
Solution Approach 1:
The patent implements a feedback mechanism where dynamic impact forces are measured during pick-and-place operations, and this data is used to adjust machine parameters. The system monitors impact forces in real-time and provides feedback to control the pick-and-place machine, enabling it to operate at high speeds while maintaining device integrity by preventing excessive impact forces that could cause damage.
3Reliability
If contact force during picking is increased, then part handling reliability improves, but internal damage such as silicon die cracks occurs
Solution Approach 1:
The patent uses parameter changes to optimize the contact force during picking operations. By measuring the actual impact forces and analyzing the relationship between contact force and device damage, the system adjusts machine parameters such as pickup force, placement force, and acceleration rates. This enables reliable part handling while preventing internal damage like silicon die cracks by maintaining contact forces within safe thresholds.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the quantification of the impact force required to damage integrated circuit devices, helping to prevent damage by ensuring production machinery operates within safe force thresholds, thereby improving device reliability and reducing failure rates.
Implementation Method 1
a load cell to quantify the force
Implementation Method 2
applies and measures reproducible dynamic forces
Data Source
AI summary
In a method and apparatus for determining the level of dynamic force required to cause damage to an electronic device, the electronic device may be placed beneath a ram assembly of a dynamic impact testing device. Thereafter, the ram assembly may be used to impact the electronic device to determine a threshold level of dynamic force that will cause damage to the electronic device. The ram assembly may then be used to impact a load cell with the threshold level of dynamic force so that the load cell generates a data output.